pvd chamber and process for over-coating layer to improve emissivity for low emissivity coating
A method for making low emissivity panels, including control the ion characteristics, such as ion energy, ion density and ion to neutral ratio, in a sputter deposition process of a layer deposited on a thin conductive silver layer. The ion control can prevent or minimize degrading the quality of the conductive silver layer, which can lead to better transmittance in visible regime, block more heat transfer from the low emissivity panels, and potentially can reduce the requirements for other layers, so that the overall performance, such as durability, could be improved.
1 . A method for coating a substrate, the method comprising
providing the substrate;
depositing a first layer over the substrate,
wherein the first layer comprises a conductive material,
wherein the thickness of the first layer is less than 20 nm;
depositing a second layer on the first layer,
wherein the depositing is a sputter deposition process,
wherein the sputter deposition process produces ion and neutral species;
wherein the ion to neutral species ratio is altered by passing the ion and neutral species through a shield maintained at a voltage.
2 . A method as in claim 1 , further comprising
forming an underlayer between the substrate and the first layer.
3 . A method as in claim 1 wherein the first layer comprises silver.
4 . A method as in claim 1 , wherein the thickness of the first layer is less than 10 nm.
5 . A method as in claim 1 wherein the second layer comprises titanium or ZnO.
6 . A method as in claim 1 wherein ions in the sputter deposition process are controlled to maintain the resistivity of the layers on the substrate to be less than or equal to 5 μΩ-cm.
7 . A method as in claim 1 wherein ions in the sputter deposition process are controlled to maintain the emissivity of the layers on the substrate to be less than or equal to 9%.
8 . A method as in claim 1 , wherein the shield is maintained at a ground potential.
9 . A method as in claim 1 , wherein the shield is coupled to a power supply.
10 . A method as in claim 1 , wherein a distance between a target to the substrate in the second deposition process is longer than a distance between a target to the substrate in the first deposition process.
11 . A system for coating a substrate, the system comprising
a transport mechanism for transporting a substrate;
a first sputter deposition chamber for sputter depositing a first layer on the substrate, wherein sputter depositing a first layer comprises generating first ion and neutral species in the first sputter deposition chamber;
a second sputter deposition chamber for sputter depositing a second layer on the first layer, wherein sputter depositing a second layer comprises generating second ion and neutral species in the second sputter deposition chamber, wherein the second ion to neutral species ratio is altered by passing the second ion and neutral species through a shield maintained at a voltage;
wherein the transport mechanism transfers the substrate from the first sputter deposition chamber to the second sputter deposition chamber.
12 . A system as in claim 11 , wherein a distance between a target to the substrate in the second deposition chamber is longer than a distance between a target to the substrate in the first deposition chamber.
13 . A system as in claim 11 , wherein the shield is maintained at a ground potential.
14 . A system as in claim 11 , wherein the shield is coupled to a power supply.
15 . A system as in claim 11 , wherein the first sputter deposition chamber is operable to deposit a silver layer, and wherein the second sputter deposition chamber is operable to deposit a titanium layer or a ZnO layer.
16 . A system as in claim 11 , further comprising
a third sputter deposition chamber for sputter depositing an underlayer between the substrate and the first layer.
17 . A method as in claim 11 wherein the first layer comprises silver and wherein the second layer comprises titanium or ZnO.
18 . A method as in claim 11 , wherein the thickness of the first layer is less than 10 nm.
19 . A system for coating a substrate, the system comprising
a transport mechanism for transporting a substrate;
a first sputter deposition chamber for sputter depositing a first layer on the substrate, wherein sputter depositing a first layer comprises generating first ion and neutral species in the first sputter deposition chamber;
a second sputter deposition chamber for sputter depositing a second layer on the first layer, wherein sputter depositing a second layer comprises generating second ion and neutral species in the second sputter deposition chamber;
wherein the transport mechanism transfers the substrate from the first sputter deposition chamber to the second sputter deposition chamber,
wherein the second ion to neutral species ratio is smaller than the first ion to neutral species ratio.
20 . A method as in claim 19 , wherein the second deposition process comprises a shield disposed between a target and the substrate, and wherein the shield is coupled to a power supply.