Micro pick up array with integrated pivot mount
Systems and methods for transferring a micro device from a carrier substrate include, in an embodiment, a micro pick up array structure to allow the micro pick up array to automatically align with the carrier substrate. Deflection of the micro pick up array may be detected to control further movement of the micro pick up array.
1. A micro pick up array to pick up an array of micro devices, the micro pick up array comprising:
a substrate including a base, a pivot platform having a platform surface, and a beam, wherein the base is laterally around the pivot platform, wherein the beam is between the pivot platform and the base, wherein the beam is coupled with the pivot platform at an inner pivot and coupled with the base at an outer pivot, wherein the outer pivot is on a base edge and the inner pivot is on a pivot platform edge, wherein the base edge is orthogonal to the pivot platform edge, and wherein the beam is laterally around the pivot platform and coupled with the pivot platform at a second inner pivot and coupled with the base at a second outer pivot; and
an array of electrostatic transfer heads supported by the platform surface of the pivot platform.
2. The micro pick up array of claim 1 , wherein the inner pivot is across the pivot platform from the second inner pivot, and wherein the outer pivot is across the pivot platform from the second outer pivot.
3. The micro pick up array of claim 1 , wherein the inner pivot and outer pivot comprise silicon.
4. The micro pick up array of claim 1 , wherein each electrostatic transfer head includes a top surface having a surface area in a range of 1 to 10,000 square micrometers.
5. The micro pick up array of claim 1 further comprising an operating voltage source contact on the base, the operating voltage source contact in electrical connection with the array of electrostatic transfer heads.
6. The micro pick up array of claim 5 further comprising a trace, wherein the operating voltage source contact is in electrical connection with the array of electrostatic transfer heads through the trace.
7. The micro pick up array of claim 6 , wherein the trace runs over the beam and further comprising a dummy trace running over the beam across the pivot platform from the trace.
8. A micro pick up array to pick up an array of micro devices, the micro pick up array comprising:
a substrate including a base, a pivot platform having a platform surface, and a beam, wherein the base is laterally around the pivot platform, wherein the beam is between the pivot platform and the base, and wherein the beam is coupled with the pivot platform at an inner pivot and coupled with the base at an outer pivot;
an array of electrostatic transfer heads supported by the platform surface of the pivot platform;
a heating contact on the base; and
a heating element over the pivot platform in electrical connection with the heating contact.
9. The micro pick up array of claim 8 further comprising a temperature sensor on the pivot platform.
10. The micro pick up array of claim 8 , wherein the heating element is on the pivot platform.
11. The micro pick up array of claim 8 , wherein the outer pivot is on a base edge and the inner pivot is on a pivot platform edge, and wherein the base edge is orthogonal to the pivot platform edge.
12. The micro pick up array of claim 11 further comprising a second beam coupled with the base by a second outer pivot on a second base edge and coupled with the pivot platform by a second inner pivot on a second pivot platform edge.
13. The micro pick up array of claim 11 , wherein the beam is laterally around the pivot platform and coupled with the pivot platform at a second inner pivot and coupled with the base at a second outer pivot.
14. The micro pick up array of claim 13 , wherein the inner pivot is across the pivot platform from the second inner pivot, and wherein the outer pivot is across the pivot platform from the second outer pivot.
15. The micro pick up array of claim 8 , wherein the inner pivot and outer pivot comprise silicon.
16. The micro pick up array of claim 8 , wherein each electrostatic transfer head includes a top surface having a surface area in a range of 1 to 10,000 square micrometers.
17. The micro pick up array of claim 8 further comprising an operating voltage source contact on the base, the operating voltage source contact in electrical connection with the array of electrostatic transfer heads.
18. The micro pick up array of claim 17 further comprising a trace, wherein the operating voltage source contact is in electrical connection with the array of electrostatic transfer heads through the trace.
19. The micro pick up array of claim 18 , wherein the trace runs over the beam and further comprising a dummy trace running over the beam across the pivot platform from the trace.