Microelectromechanical z-axis out-of-plane stopper
View Patent ↗The present invention relates to a microelectromechanical structure, and more particularly, to systems, devices and methods of incorporating z-axis out-of-plane stoppers that are controlled to protect the structure from both mechanical shock and electrostatic disturbance. The z-axis out-of plane stoppers include shock stoppers and balance stoppers. The shock stoppers are arranged on a cap substrate that is used to package the structure. These shock stoppers are further aligned to a proof mass in the structure to reduce the impact of the mechanical shock. The balance stoppers are placed underneath the proof mass, and electrically coupled to a balance voltage, such that electrostatic force and torque imposed by the shock stoppers is balanced by that force and torque generated by the balance stoppers. This structure is less susceptible to mechanical shock, and shows a negligible offset that may be induced by electrostatic disturbance caused by the shock stoppers.
1. A microelectromechanical structure comprising:
a sensor substrate;
a proof mass suspended above the sensor substrate via at least one elastic element, the proof mass displacing and titling in response to acceleration of the structure;
a cap substrate coupled to the sensor substrate, the cap substrate being bonded to the sensor substrate to form a cavity that encloses the proof mass, the cap substrate further comprising a plurality of shock stoppers that are arranged above the proof mass to push back the proof mass at specific locations upon a shock load; and
a plurality of balance stoppers coupled underneath the proof mass, each of the plurality of balance stoppers being arranged according to a position of one of the plurality of shock stoppers and electrically driven by a balance voltage, each of the plurality of balance stoppers generating first electrostatic force and torque on the proof mass to balance second force and torque generated by a corresponding shock stopper.
2. The microelectromechanical structure according to claim 1 , further comprising a sensor electrode that is arranged on the sensor substrate, the sensor electrode being coupled to an electrode on the proof mass to form a capacitor, a capacitance variation of the capacitor indicating a magnitude of an acceleration rate.
3. The microelectromechanical structure according to claim 2 , wherein the sensor substrate further integrates a readout circuit that is coupled to process the capacitance variation.
4. The microelectromechanical structure according to claim 2 , wherein the sensor electrode and the plurality of balance stoppers are made from a same layer of conducting film.
5. The microelectromechanical structure according to claim 2 , wherein the plurality of balance stoppers is of the same material as the sensor substrate.
6. The microelectromechanical structure according to claim 1 , wherein the structure is applied to detect out-of-plane acceleration that is perpendicular to a plane of the proof mass.
7. The microelectromechanical structure according to claim 1 , wherein the cap substrate further comprises an edge, the cap and sensor substrates being bonded at the edge.
8. The microelectromechanical structure according to claim 7 , wherein the edge and the plurality of shock stoppers have different heights.
9. The microelectromechanical structure according to claim 7 , wherein the edge and the plurality of shock stoppers are formed by one method selected from recessing the cap substrate and assembling extrinsic edge and shock stopper parts on the cap substrate.
10. The microelectromechanical structure according to claim 1 , wherein the sensor and cap substrates are bonded by a process selected from a metal-to-metal bonding process and a silicon-to-metal bonding process.
11. A method of protecting a microelectromechanical structure from mechanical shock and electrostatic disturbance, comprising the steps of:
integrating a plurality of shock stoppers on a cap substrate, the cap substrate being bonded to a sensor substrate to form a cavity that encloses a proof mass, the proof mass being suspended above the sensor substrate via at least one elastic element such that the proof mass displaces and tilts in response to acceleration of the structure, the plurality of shock stoppers being arranged above the proof mass to push back the proof mass at specific locations upon a shock load;
arranging a plurality of balance stoppers underneath the proof mass according to a position of one of the plurality of shock stoppers; and
coupling each of the plurality of balance stoppers electrically to a balance voltage, each of the plurality of balance stoppers generating first electrostatic force and torque on the proof mass to balance second force and torque generated by a corresponding shock stopper.
12. The method according to claim 11 , wherein a sensor electrode is arranged on the sensor substrate, the sensor electrode being coupled to an electrode on the proof mass to form a capacitor, a capacitance variation of the capacitor indicating a magnitude of acceleration.
13. The method according to claim 12 , wherein the sensor substrate further integrates a readout circuit that is coupled to process the capacitance variation.
14. The method according to claim 12 , wherein the sensor electrode and the plurality of balance stoppers are made from a same layer of conducting film.
15. The method according to claim 11 , wherein the plurality of balance stoppers is made directly on the sensor substrate.
16. The method according to claim 11 , wherein the structure is applied to detect out-of-plane acceleration that is perpendicular to a plane of the proof mass.
17. The method according to claim 11 , wherein the cap substrate further comprises an edge, the cap and sensor substrates being bonded at the edge.
18. The method according to claim 17 , wherein the edge has a distinct height from that of the plurality of shock stoppers.
19. The method according to claim 17 , wherein the edge and the plurality of shock stoppers are formed by one method selected from recessing the cap substrate and assembling extrinsic edge and shock stopper parts on the cap substrate.
20. The method according to claim 11 , wherein the sensor and cap substrates are bonded by a process selected from a metal-to-metal bonding process and a silicon-to-metal bonding process, and the cap substrate is polarized at ground or at a specific voltage.