LED chip-based lighting products and methods of building
View Patent ↗A method of building a light-emitting diode (LED) based lighting product includes mounting a plurality of unpackaged LED chips or LEDs directly on conductors on a surface of a two-sided panel, integrating the panel with support structure to form the lighting product such that at least one surface of the panel forms an external surface of the lighting product, and coupling a diffuser, with a distance from the diffuser to the surface of the LED chips or LEDs being at least twice an average spacing between adjacent LED chips or LEDs. A method of building a an LED chip-based lighting product includes mounting unpackaged LED chips directly on conductors formed on a surface of a two-sided panel, and mounting a cover plate to the LED chips such that light emitted from the LED chips passes through the cover plate.
1. LED chip-based lighting product, comprising:
PCB with at least one LED chip mounted directly thereon;
cover plate coupled with the PCB such that light emitted by the LED chip transmits through the cover plate;
fill material between the PCB and the cover plate; and
an insulating dam that bounds a space between the cover plate and the PCB for containing the fill material therein.
2. LED chip-based lighting product of claim 1 , further comprising phosphor layer between LED chips and the cover plate, such that light emitted by the LED chip causes fluorescence in the phosphor layer.
3. LED chip-based lighting product of claim 2 , the phosphor layer being present only between the LED chip and the cover plate.
4. LED chip-based lighting product of claim 1 , the cover plate comprising phosphor.
5. LED chip-based lighting product of claim 1 , further comprising conformal gel between the LED chip and the cover plate.
6. LED chip-based lighting product of claim 5 , the conformal gel having a refractive index that matched to the cover plate.
7. LED chip-based lighting product of claim 5 , further comprising a phosphor admixed with the conformal gel, such that light emitted by the LED chip fluroesces the phosphor.
8. LED chip-based lighting product of claim 1 , further comprising at least one standoff attached to the PCB and the cover plate, thereby defining a separation distance between the PCB and the cover plate.
9. LED chip-based lighting product of claim 8 , the cover plate comprising at least one conductor, the standoff forming an electrical connection between the PCB and the conductor.
10. LED chip-based lighting product of claim 1 , further comprising a reflector attached to at least one of the PCB and the cover plate, to reflect light emitted by the LED chip through the cover plate.
11. LED chip-based lighting product of claim 10 , wherein the reflector couples to the PCB and the cover plate and defines a separation distance between the PCB and the cover plate.
12. LED chip-based lighting product of claim 10 , the reflector forming an electrical connection between the PCB and the conductor.
13. LED chip-based lighting product of claim 1 , the cover plate forming optics that modify light passing therethrough.
14. LED chip-based lighting product of claim 1 , the LED chip comprising a plurality of LED chips.
15. LED chip-based lighting product of claim 14 , the plurality of LED chips being arranged as an array on the PCB.
16. LED chip-based lighting product of claim 14 , the plurality of LED chips being arranged stochastically on the PCB.
17. LED chip-based lighting product, comprising:
a panel having an inner surface, and a counterfacing outer surface that forms at least part of an external surface of the lighting product;
conductors patterned on the inner surface, and
a plurality of unpackaged LED chips stochastically mounted to the conductors such that lines, grids or other regular patterns are not visually present.
18. LED chip-based lighting product of claim 17 , the panel comprising an aluminum troffer, the plurality of unpackaged LED chips comprising 500 unpackaged LED chips.
19. LED chip-based lighting product of claim 17 , at least some of the plurality of unpackaged LED chips having one or both of a protective material and a phosphor applied thereto.
20. LED chip-based lighting product of claim 17 , further comprising a heat sink coupled with the outer surface.