MEMS microphone with spring suspended backplate

1. A MEMS microphone comprising:

a base;

a backplate having a plurality of apertures;

a backplate spring suspending the backplate from the base, the backplate spring being a single solid member and substantially serpentine-shaped; and

a diaphragm forming a variable capacitor with the backplate,

wherein when the microphone is stationary, the backplate spring has a spring constant that is high enough to cause the backplate to remain substantially stationary upon receipt of audio signals having amplitudes on the order of magnitude of the human speaking voice.

2. The MEMS microphone as defined by claim 1 wherein a plurality of backplate springs circumscribe the backplate.

3. The MEMS microphone as defined by claim 2 wherein the backplate has a thickness, the backplate spring having a thickness that is less than the thickness of the backplate.

4. A MEMS microphone comprising:

a base;

a backplate having a plurality of apertures;

a backplate spring suspending the backplate from the base, the backplate spring being a single solid member and substantially serpentine-shaped; and

a diaphragm forming a variable capacitor with the backplate, wherein the diaphragm has a diaphragm spring with a diaphragm spring constant, the backplate spring having a backplate spring constant, the backplate spring constant being at least ten times larger than the diaphragm spring constant.

5. A method of reducing stress on a MEMS microphone backplate, the method comprising:

providing a base;

supporting a diaphragm on the base;

forming a variable capacitor by spacing a backplate from the diaphragm, the backplate being connected to the base with a plurality of springs configured to reduce stress on the backplate, the spring being a single solid member and substantially serpentine-shaped; and

applying an incident audio signal of a spoken human voice against the backplate and diaphragm while the base remains substantially immovable, the backplate remaining substantially immovable upon receipt of the audio signal.

6. The method as defined by claim 5 wherein the backplate is connected to the base with a plurality of springs, further comprising forming a trench around at least a portion of the diaphragm.

7. The method as defined by claim 5 wherein the base is formed from a first material, at least one of the springs being formed from a second material, the first and second materials being different.

8. A MEMS microphone comprising:

a base;

a backplate having a plurality of trenches and a central portion with through-holes, the backplate trenches substantially circumscribing the through-holes, the backplate comprised of a static backplate, the trenches creating an active sensing area of the backplate, the active sensing area located radially inward from the trenches and being effectively isolated; and

wherein when the microphone is stationary, the backplate spring has a spring constant that is high enough to cause the backplate to remain substantially stationary upon receipt of audio signals having amplitudes on the order of magnitude of the human speaking voice.

9. The MEMS microphone, as recited in claim 7 , further including a diaphragm forming a variable capacitor with the backplate.

10. The MEMS microphone, as recited in claim 7 , further including a backplate spring suspending the backplate from the base.

11. The MEMS microphone, as recited in claim 10 , wherein the backplate spring is a single solid member and substantially serpentine-shaped.

12. The MEMS microphone, as recited in claim 10 , wherein the backplate spring is solid.

13. The MEMS microphone, as recited in claim 9 , wherein the active sensing area is the portion of the backplate that forms the substantial majority of the variable capacitance with the diaphragm.

14. The MEMS microphone as defined by claim 4 , wherein a pluralitly of backplate springs circumscribe the backplate.

15. The MEMS microphone as defined by claim 14 wherein the backplate has a thickness, the backplate spring having a thickness that is less than the thickness of the backplate.