Semiconductor device having plural semiconductor chip stacked with one another
View Patent ↗Disclosed herein is a device that includes: external terminals; a first chip including a first control circuit that generates a first control signal; and a second chip stacked with the first chip. The second chip includes: a first test terminal supplied with a first test signal and being free from connecting to any one of the external terminals; a second test terminal supplied with the first test signal and coupled to one of the external terminals without connecting to any one of control circuits of the first chip; a first normal terminal supplied with the first control signal and coupled to another of the external terminals with an intervention of the first control circuit of the first chip; and a first selection circuit including first input node coupled in common to the first and second test terminals and the second input node coupled to the first normal terminal.
1. A device comprising:
a plurality of external terminals including first and second external terminals;
a first semiconductor chip including a plurality of control circuits that comprises a first control circuit, the first control circuit generating a first control signal; and
a second semiconductor chip stacked with the first semiconductor chip, the second semiconductor chip comprising;
a first test terminal configured to be supplied with a first test signal, the first test terminal being free from connecting to any one of the external terminals;
a second test terminal configured to be supplied with the first test signal, the second test terminal being coupled to the first external terminal without connecting to any one of control circuits of the first semiconductor chip;
a first normal terminal configured to be supplied with the first control signal, the first normal terminal being coupled to the second external terminal with an intervention of the first control circuit of the first semiconductor chip; and
a first selection circuit including first and second input nodes, the first input node being coupled in common to the first and second test terminals and the second input node being coupled to the first normal terminal.
2. The device as claimed in claim 1 , wherein the second semiconductor chip further comprises a first test input buffer coupled in common to the first and second test terminals at an input node thereof and coupled to the first input node of the first selection circuit at an output node thereof.
3. The device as claimed in claim 1 , wherein the second semiconductor chip further comprises first and second test input buffers, the first test input buffer is coupled to the first test terminal at an input node thereof, the second test input buffer is coupled to the second test terminal at an input node thereof, and the first input node of the first selection circuit is coupled in common to output nodes of the first and second test input buffers.
4. The device as claimed in claim 1 , wherein the control circuits of the first semiconductor chip comprises a plurality of second control circuits generating a plurality of second control signals, and the second semiconductor chip further comprises;
a plurality of second normal terminals each configured to be supplied with an associated one of the second control signals, and
a plurality of second selection circuits each including first and second input nodes, the first input node of each of the second selection circuits being coupled in common to the first and second test terminals, and the second input node of each of the second selection circuits being coupled to an associated one of the second normal terminals.
5. The device as claimed in claim 4 , wherein the second semiconductor chip further comprises;
a first channel comprising the first selection circuit, and
a plurality of second channel each comprising an associated one of the second selection circuits, and
the first and second internal devices are configured to operate independently of each other.
6. The device as claimed in claim 5 , wherein each of the first and second channels is configured to operate as DRAM.
7. The device as claimed in claim 1 , wherein the first semiconductor chip further comprises;
a semiconductor substrate,
a first penetration electrode penetrating through the semiconductor substrate and being free from connecting to any one of the control circuits, the first penetration electrode being coupled to the second test terminal of the second semiconductor chip, and
a second penetration electrode penetrating through the semiconductor substrate and coupled to the first control circuit, the second penetration electrode being coupled to the first normal terminal of the second semiconductor chip.
8. The device as claimed in claim 1 , wherein the second semiconductor chip further comprises;
a semiconductor substrate,
a first test penetration electrode penetrating through the semiconductor substrate and coupled to the second test terminal, and
a first normal penetration electrode penetrating through the semiconductor substrate and coupled to the first normal terminal.
9. The device as claimed in claim 1 , wherein the first test terminal is a test pad, each of the second test terminal and the first normal terminal is a bump electrode.
10. The device as claimed in claim 1 , wherein the first test terminal is a test pad, each of the second test terminal and the first normal terminal is a bonding pad coupled to a bonding wiring.
11. The device as claimed in claim 1 , wherein the first test signal includes one of a test address signal, a test command signal and a test clock signal, and the first control signal includes one of a normal address signal, a normal command signal and a normal clock signal.