Semiconductor package and method for fabricating base for semiconductor package
The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a conductive trace embedded in a base. A semiconductor device is mounted on the conductive trace via a conductive structure.
1. A method for fabricating a base for a semiconductor package, comprising:
providing a carrier with conductive seed layers on a top surface and a bottom surface of the carrier;
forming first conductive traces respectively on the conductive seed layers;
performing a laminating process to respectively dispose a first base material layer and a second base material layer on the conductive seed layers, covering the first conductive traces;
forming second conductive traces respectively on first surfaces of the first base material layer and the second base material layer, wherein the first surfaces of the first base material layer and the second base material layer are respectively away from the top surface and the bottom surface of the carrier; and
separating the first base material layer containing the first and second conductive traces thereon and the second base material layer containing the first and second conductive traces thereon from the carrier to form a first base and a second base.
2. The method for fabricating a base for a semiconductor package as claimed in claim 1 , wherein the first conductive traces and the second conductive traces are formed by a plating process and an anisotropic etching process.
3. The method for fabricating a base for a semiconductor package as claimed in claim 1 , further comprising:
removing conductive seed layers from the first base and the second base.
4. The method for fabricating a base for a semiconductor package as claimed in claim 1 , further comprising:
forming an insulation layer having openings on each of the first and second bases, wherein the first conductive traces of each of the first and second bases are exposed within the openings.
5. The method for fabricating a base for a semiconductor package as claimed in claim 1 , wherein the first conductive traces of the first and second bases are aligned to second surfaces of the of the first and second bases, and wherein the second surfaces are respectively opposite to the first surfaces of the first and second bases.
6. The method for fabricating a base for a semiconductor package as claimed in claim 1 , wherein the first conductive traces have a width which is larger than 5 μm.
7. The method for fabricating a base for a semiconductor package as claimed in claim 1 , further comprising:
performing a drilling process to form openings through the first base material layer and the second base material layer; and
performing a plating process to fill a conductive material into the opening to form a via for interconnecting the first conductive traces to the second conductive traces, before forming the second conductive traces.
8. The method for fabricating a base for a semiconductor package as claimed in claim 7 , wherein the drilling process comprises a laser drilling process, an etching drilling process or a mechanical drilling process, and the plating process comprises an electrical plating process.