An optical module includes a circuit board, a photoelectric conversion element mounted on the circuit board, an optical connector for optically connecting the photoelectric conversion element and an optical fiber, a semiconductor circuit element mounted on the circuit board and electrically connected to the photoelectric conversion element, a pressing member for pressing and fixing the optical connector to the circuit board, and a supporting member for supporting the pressing member. The supporting member includes a heat-absorbing surface and a heat-dissipating surface. The heat-absorbing surface is thermally connected to the semiconductor circuit element. The heat-dissipating surface dissipates heat of the semiconductor circuit element to be absorbed through the heat-absorbing surface.
1. An optical module, comprising:
a circuit board;
a photoelectric conversion element mounted on the circuit board;
an optical connector for optically connecting the photoelectric conversion element and an optical fiber;
a semiconductor circuit element mounted on the circuit board and electrically connected to the photoelectric conversion element;
a rod-shaped elastic pressing member for pressing and fixing the optical connector to the circuit board; and
a supporting member for supporting the rod-shaped elastic pressing member,
wherein the circuit board comprises a plurality of electrodes on a non-mounting surface that is opposite to a mounting surface with the semiconductor circuit element mounted thereon,
wherein the supporting member comprises an attaching portion to be fixed to a counterpart board that has a plurality of counterpart electrodes electrically connected to the plurality of electrodes,
wherein the rod-shaped elastic pressing member comprises a supported portion to be supported by the supporting member so as to pivot about the supported portion,
wherein the supporting member comprises a fixing portion for fixing the rod-shaped elastic pressing member in a state that the optical connector is pressed by the rod-shaped elastic pressing member,
wherein the supporting member comprises a heat-absorbing surface and a heat-dissipating surface,
wherein the heat-absorbing surface is thermally connected to the semiconductor circuit element, and
wherein the heat-dissipating surface dissipates heat of the semiconductor circuit element to be absorbed through the heat-absorbing surface.
2. The optical module according to claim 1 , wherein the heat-absorbing surface is formed parallel to the circuit board while sandwiching the semiconductor circuit element in between,
wherein a gap between the heat-absorbing surface and the circuit board corresponds to a thickness of the semiconductor circuit element, and
wherein a heat transfer member for conducting heat from the semiconductor circuit element to the heat-absorbing surface is disposed between the heat-absorbing surface and the semiconductor circuit element.
3. The optical module according to claim 1 , wherein the optical connector is restricted from moving in a direction parallel to the circuit board by fitting a protrusion provided upright on the circuit board.
4. The optical module according to claim 1 , wherein the rod-shaped elastic member comprises at least one pressing portion and a handling portion, the at least one pressing portion pressing the optical connector in the pressed state, the handling portion being bent so that a space is formed between the handling portion and the optical connector in the pressed state.