IP Library Granted Patent US 9,070,938
Granted Patent B2
US 9,070,938 · App. 13/723,340 · Granted Jun 30, 2015

Terminal lead

Inventors: Daisuke Hashimoto (Oyama, JP); Takurou Watanabe (Oyama, JP); Keiichi Yokoi (Minato-ku, JP); Hiroshi Hata (Isehara, JP)
Assignee: Showa Denko Packaging Co., Ltd.
H01M2/30H01G11/74H01G11/76H01M2/06Y02E60/13
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Quick Facts
Patent No.
US 9,070,938
App. No.
13/723,340
Granted
Jun 30, 2015
Kind
B2
Abstract

A terminal lead 1 includes an inner end portion 1 a to be arranged inwardly of an exterior casing 9 which accommodates an electrochemistry element 6 , an outer end portion 1 b to be arranged outwardly of the exterior casing 9 , and a plate-shaped metallic substrate 2 as a base material. An insulating resin film 4 is arranged at a portion of the terminal lead 1 corresponding to a seal portion 9 x of the exterior casing 9 . In this terminal lead 1 , a surface coating layer 3 is formed on both surfaces 2 p and 2 p of the metallic substrate 2 in a thickness direction thereof. A coated amount of both widthwise end portions 3 a and 3 a of the surface coating layer 3 formed on both surfaces 2 p and 2 p of the metallic substrate 2 in the thickness direction is less than that a widthwise intermediate portion 3 b thereof.

Claims (16)

1. A terminal lead comprising:

an inner end portion to be arranged inwardly of an exterior casing which accommodates an electrochemical element;

an outer end portion to be arranged outwardly of the exterior casing;

a plate-shaped metallic substrate as a base material;

an insulating resin film to be arranged at a portion of the metallic substrate corresponding to a seal portion of the exterior casing; and

a surface coating layer formed on both surfaces of the metallic substrate in a thickness direction of the metallic substrate; wherein

a coated amount of both widthwise end portions of the surface coating layer formed on both the surfaces of the metallic substrate in the thickness direction is less than a coated amount of a widthwise intermediate portion of the surface coating layer formed on both the surfaces of the metallic substrate in the thickness direction.

2. The terminal lead as recited in claim 1 , wherein the surface coating layer contains one or more chemical compounds selected from the group consisting of chitosan and chitosan derivative.

3. A production method of a terminal lead including an inner end portion to be arranged inwardly of an exterior casing which accommodates an electrochemical element, an outer end portion to be arranged outwardly of the exterior casing, a plate-shaped metallic substrate as a base material, and an insulating resin film to be arranged at a portion of the metallic substrate corresponding to a seal portion of the exterior casing, the method comprising the steps of:

cutting an elongated member of the terminal lead in which a surface coating layer is formed on both surfaces of an elongated member of the metallic substrate in a thickness direction of the metallic substrate, and

coating the surface coating layer on the metallic substrate such that a coated amount of both widthwise end portions of the surface coating layer formed on both surfaces of the elongated member of the metallic substrate in the thickness direction is less than a coated amount of a widthwise intermediate portion of the surface coating layer formed on both surfaces of the elongated member of the metallic substrate in the thickness direction.

4. The production method as recited in claim 3 , wherein the surface coating layer contains one or more chemical compounds selected from the group consisting of chitosan and chitosan derivative.

5. An electrochemical device equipped with the terminal lead as recited in claim 1 .

6. The electrochemical device as recited in claim 5 , wherein the surface coating layer contains one or more chemical compounds selected from the group consisting of chitosan and chitosan derivative.

7. The terminal lead as recited in claim 1 , wherein the surface coating layer is provided on an entirety of both surfaces of the metallic substrate in the thickness direction of the metallic substrate.

8. The production method as recited in claim 3 , further comprising the step of entirely coating both surfaces of the elongated member of the metallic substrate in the thickness direction with the surface coating layer.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 5, 2014
From: SHOWA DENKO K.K.
To: SHOWA DENKO PACKAGING CO.
Reel/Frame 032354/0426 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 6, 2013
From: HASHIMOTO, DAISUKE; WATANABE, TAKUROU; YOKOI, KEIICHI; HATA, HIROSHI
To: SHOWA DENKO K.K.; SHOWA DENKO PACKAGING CO., LTD.
Reel/Frame 030555/0162 →
Priority Claims (1)
JP 2011-282689 · Dec 26, 2011 · national
Continuity (1)
Related Publication 20130164613A1 · Jun 27, 2013