METHOD FOR PROVIDING A MAGNETIC RECORDING TRANSDUCER INCLUDING A WRAPAROUND SHIELD AND A RECTANGULAR POLE
A method fabricates a magnetic transducer having an ABS location. Etch stop and nonmagnetic etchable layers are provided. A side shield layer is provided between the ABS location and the etch stop and etchable layers. Part of the side shield and etchable layers are removed using a first removal process. This portion of the pole trench formed has a top wider than the bottom in the side shield layer. Part of the etchable layer is removed using a second removal process, thereby forming the pole trench. The pole trench has a bottom and a top wider than the bottom in the side shield layer and substantially perpendicular sidewalls in the etchable layer. A nonmagnetic side gap layer is provided. A remaining portion of the pole trench has a location and profile for a pole. At least part of the pole is in the pole trench.
1 . A method for fabricating a magnetic transducer having an air-bearing surface location (ABS location) corresponding to an air-bearing surface (ABS), the method comprising:
providing an etch stop layer;
providing a nonmagnetic etchable layer on the etch stop layer;
providing a side shield layer residing between the ABS location and the etch stop layer and between the ABS location and the etchable layer;
removing a first portion of the side shield layer and first portion of the nonmagnetic etchable layer using a first removal process, thereby forming a first portion of a pole trench, the first portion of the pole trench having a bottom and a top wider than the bottom in the side shield layer;
removing at least a second portion of the nonmagnetic etchable layer using a second removal process, thereby forming the pole trench, the pole trench having a pole trench bottom and a pole trench top wider than the pole trench bottom in the side shield layer and a substantially perpendicular sidewalls in the nonmagnetic etchable layer;
providing a nonmagnetic side gap layer, at least a portion of the nonmagnetic side gap layer residing in the pole trench, a remaining portion of the pole trench having a location and profile for a pole;
forming the pole, at least a portion of the pole residing in the remaining portion of the pole trench;
providing a write gap, at least a portion of the write gap being on the pole; and
providing a trailing shield, at least a portion of the trailing shield being on the write gap.
2 . The method of claim 1 further comprising:
providing a hard mask, the hard mask having an aperture therein corresponding to the pole trench.
3 . The method of claim 2 wherein the hard mask includes at least one of Ti and Ta.
4 . The method of claim 1 wherein the side shield layer includes Ni x Fe 1-x where x is at least 0.17 and not more than 0.7.
5 . The method of claim 1 wherein the etch stop layer includes Ta.
6 . The method of claim 1 wherein the etchable layer includes SiO 2 .
7 . The method of claim 1 further comprising:
providing a nonmagnetic layer on the nonmagnetic etchable layer and on the side shield layer, wherein the first removal process removes a first portion of the nonmagnetic layer and the second removal process removes a second portion of the nonmagnetic layer above the nonmagnetic etchable layer
8 . The method of claim 7 wherein the nonmagnetic layer includes NiCr.
9 . The method of claim 1 wherein the first removal process further includes: a reactive ion etch utilizing a NiFe etch chemistry.
10 . The method of claim 1 wherein the second removal process further includes a reactive ion etch utilizing SiO 2 etch chemistry.
11 . The method of claim 1 wherein the nonmagnetic etchable layer is at least twenty and not more than sixty nanometers from the ABS location.
12 . A method for fabricating a magnetic transducer having an air-bearing surface location (ABS location) corresponding to an air-bearing surface (ABS), the method comprising:
providing an etch stop layer including Ta;
providing a nonmagnetic etchable layer on the etch stop layer, the nonmagnetic etchable layer including SiO 2 , the nonmagnetic etchable layer terminating at least twenty nanometers and not more than sixty nanometers from the ABS location;
providing a side shield layer residing between the ABS location and the etch stop layer and between the ABS location and the etchable layer, the side shield layer including NiFe;
removing a first portion of the side shield layer and first portion of the nonmagnetic etchable layer using a first removal process, thereby forming a first portion of a pole trench, the first portion of the pole trench having a bottom and a top wider than the bottom in the side shield layer, the first removal process including a first reactive ion etch utilizing a NiFe etch chemistry;
removing at least a second portion of the nonmagnetic etchable layer using a second removal process, thereby forming the pole trench, the pole trench having a pole trench bottom and a pole trench top wider than the pole trench bottom in the side shield layer and a substantially perpendicular sidewalls in the nonmagnetic etchable layer, the second removal process including a second reactive ion etch utilizing SiO 2 etch chemistry;
providing a nonmagnetic side gap layer, at least a portion of the nonmagnetic side gap layer residing in the pole trench, a remaining portion of the pole trench having a location and profile for a pole;
forming the pole, at least a portion of the pole residing in the remaining portion of the pole trench;
providing a write gap, at least a portion of the write gap being on the pole; and
providing a trailing shield, at least a portion of the trailing shield being on the write gap.