DEVICE FOR CUTTING A SUBSTRATE AND METHOD FOR CONTROLLING SUCH A CUTTING DEVICE
A device for cutting a substrate along a cutting line is disclosed. The device includes a saw unit with a saw blade, which can be rotated around an axis of rotation, a guide carriage for moving the saw unit along a guide rail, and a control device for controlling the saw unit and the guide carriage. A marking device is provided for marking an end point of the cutting line.
1 . A device for cutting a substrate along a cutting line, comprising:
a saw unit with a saw blade, wherein the saw blade is rotatable around an axis of rotation;
a guide carriage, wherein the saw unit is movable by the guide carriage along a guide rail;
a control device, wherein the saw unit and the guide carriage are controllable by the control device; and
a marking device associated with the guide rail, wherein an end point of the cutting line is markable by the marking device.
2 . The device according to claim 1 , further comprising a second marking device associated with the guide rail, wherein a second end point of the cutting line is markable by the second marking device.
3 . The device according to claim 1 , wherein the marking device has an optical marking element, a signal generator, and a detector device, wherein the end point is optically markable by the optical marking element, wherein a position signal corresponding to a position of the end point or a position of a reference point which is arranged at a defined distance from the end point is emittable by the signal generator, and wherein the position signal is receivable by the detector device.
4 . The device according to claim 3 , wherein the detector device is connectable to the control device and wherein information corresponding to the position signal is transmittable to the control device by the detector device.
5 . The device according to claim 2 , wherein the marking device and the second marking device have a common detector device.
6 . The device according to claim 3 , wherein the optical marking element is movable on the guide rail by a movement device.
7 . The device according to claim 3 , further comprising a mechanical end stop connected to the optical marking element.
8 . The device according to claim 3 :
wherein the signal generator has a transmitting unit, wherein a measuring beam is transmittable by the transmitting unit, and a measurement object;
and wherein the detector device has a receiving unit and an evaluation device.
9 . The device according to claim 8 , wherein the transmitting unit, the receiving unit, and the evaluation device form a laser distance measuring system or an ultrasonic distance measuring system.
10 . A method for controlling a cutting device, comprising the steps of:
generating a position signal by a signal generator, wherein the position signal corresponds to a position of an end point of a cutting line on a substrate;
receiving the position signal by a detector device;
transmitting information corresponding to the position signal to a control device by the detector device; and
controlling a drive device of the cutting device by the control device based on the transmitted information.
11 . The method according to claim 10 , wherein the end point of the cutting line is marked by a marking device.
12 . The method according to claim 10 :
wherein the signal generator has a transmitting unit and a measurement object;
and wherein the detector device has a receiving unit and an evaluation device.