Chip positioning in multi-chip package
Embodiments of the present invention include a substrate package, a method for multi-chip packaging, and a multi-chip package. For example, the substrate package includes a first set of reference markers and a second set of reference markers. The first set of reference markers is disposed on the substrate package, where the first set of reference markers is configured to provide a first alignment for positioning a first integrated circuit (IC) and a second alignment for positioning a second IC on the substrate package. Further, the second set of reference markers is disposed at a different location on the substrate package than the first set of reference markers, where the second set of reference markers is configured to provide confirmation of the first alignment and the second alignment.
1. A substrate package comprising:
a first set of reference markers disposed on and in physical contact with the substrate package to provide a first alignment for positioning a first integrated circuit (IC) and a second alignment for positioning a second IC on the substrate package; and
a second set of reference markers disposed on and in physical contact with the substrate package to provide confirmation of the first alignment and the second alignment, wherein the second set of reference markers is disposed at a different location on the substrate package than the first set of reference markers.
2. The substrate package of claim 1 , wherein the second set of reference markers is used to align the second IC to the first IC in a diagonal stack arrangement, a straight stack arrangement, or a side-by-side arrangement.
3. The substrate package of claim 1 , wherein the first set and the second set of reference markers are disposed in a mold cavity surface of the substrate package.
4. The substrate package of claim 1 , wherein at least one reference marker in the second set of reference markers comprises a triangle-shaped structure, a T-shaped structure, a cross-shaped structure, or an L-shaped structure.
5. The substrate package of claim 1 , wherein at least one reference marker in the second set of reference markers has at least one dimension greater than or equal to 0.15 mm.
6. The substrate package of claim 1 , wherein the first IC is disposed on the substrate package based on the first set of reference markers and the second IC is disposed on the first IC based on the first set of reference markers.
7. A multi-chip package comprising:
a first plurality of integrated circuits (ICs);
a second plurality of ICs; and
a substrate with the first and second plurality of ICs disposed thereon, wherein the substrate comprises:
a first set of reference markers disposed on and in physical contact with the substrate to provide a first alignment for positioning at least one of the first plurality of ICs and a second alignment for positioning at least one of the second plurality of ICs on the substrate; and
a second set of reference markers disposed on and in physical contact with the substrate to provide confirmation of the first alignment and the second alignment, wherein the second set of reference markers is disposed at a different location on the substrate than the first set of reference markers.
8. The multi-chip package of claim 7 , further comprising:
a first interconnect to provide a first wire bond between the at least one of the first plurality of ICs and the substrate; and
a second interconnect to provide a second wire bond between the at least one of the second plurality of ICs and the substrate.
9. The multi-chip package of claim 7 , wherein the substrate comprises a lead frame package, a small-outline integrated circuit (SOIC) package, or a ball grid array (BGA) array package.
10. The multi-chip package of claim 7 , wherein the second set of reference markers is used to align the second IC to the first IC in a diagonal stack arrangement, a straight stack arrangement, or a side-by-side arrangement.
11. The multi-chip package of claim 7 , wherein the first set and the second set of reference markers are disposed in a mold cavity surface of the substrate.
12. The multi-chip package of claim 7 , wherein at least one reference marker in the second set of reference markers comprises a triangle-shaped structure, a T-shaped structure, a cross-shaped structure, or an L-shaped structure.
13. The multi-chip package of claim 7 , wherein at least one reference marker in the second set of reference markers has at least one dimension greater than or equal to 0.15 mm.
14. The multi-chip package of claim 7 , wherein the first IC is disposed on the substrate based on the first set of reference markers and the second IC is disposed on the first IC based on the first set of reference markers.