Waveguide for intra-package data transfer

1. An integrated chip (IC) package, comprising:

a waveguide comprising a cavity;

a first chip including a first radio frequency (RF) transceiver coupled to a first probe that extends into the cavity of the waveguide; and

a second chip including a second RF transceiver coupled to a second probe that extends into the cavity of the waveguide;

wherein the first and second chips are configured to communicate with one another exclusively by transmitting and receiving RF signals by the first and second RF transceivers through the cavity of the waveguide via the first and second probes; and

wherein the first probe extends into the cavity of the waveguide at one-fourth of a wavelength of at least one of the RF signals from a first sidewall of the waveguide and the second probe extends into the cavity of the waveguide at a multiple of the wavelength of the at least one of the RF signals from the first probe.

2. The IC package of claim 1 , wherein the waveguide comprises a second sidewall.

3. The IC package of claim 2 , wherein at least one of the first sidewall or the second sidewall is shorted.

4. The IC package of claim 2 , wherein the waveguide further comprises a first conductive layer and a second conductive layer having the cavity therebetween, wherein the first conductive layer is over the second conductive layer.

5. The IC package of claim 4 , wherein the first chip and the second chip are mounted on a substrate over the first conductive layer and the second conductive layer.

6. The IC package of claim 4 , wherein the cavity comprises a dielectric layer and the first sidewall and the second sidewall comprise at least one of a plurality of metal posts in the dielectric layer or metal plating along an edge of the dielectric layer.

7. The IC package of claim 2 , further comprising:

a third chip including a third RF transceiver coupled to a third probe that extends into the cavity of the waveguide at one-fourth of the wavelength of the at least one of the RF signals from the second sidewall.

8. The IC package of claim 1 , wherein the first chip further includes an impedance matching circuit that matches an output impedance with an impedance of the first probe.

9. An integrated chip (IC) package, comprising:

a waveguide comprising a cavity;

a first chip including a first radio frequency (RF) transceiver coupled to a first antenna positioned over a first opening of the waveguide;

a second chip including a second RF transceiver coupled to a second antenna positioned over a second opening of the waveguide; and

a third chip including a third RF transceiver coupled to a third antenna positioned over a third opening of the waveguide;

wherein the first, second, and third chips are configured to communicate with one another exclusively by transmitting and receiving RF signals by the first, second, and third RF transceivers through the cavity of the waveguide via the first, second, and third antennas; and

wherein the first chip is configured to transmit the RF signals to a fourth chip, at least partially through the air external to the IC package, via a fourth opening of the waveguide, wherein the fourth chip is external to the IC package.

10. The IC package of claim 9 , wherein the waveguide comprises a first conductive layer and a second conductive layer, the first conductive layer being over the second conductive layer.

11. The IC package of claim 10 , wherein the first opening of the waveguide comprises a slot in the first conductive layer that radiates the RF signals to the first antenna as narrow RF beams.

12. The IC package of claim 10 , wherein the first chip, the second chip, and the third chip are mounted on a substrate over the first conductive layer and the second conductive layer.

13. The IC package of claim 9 , wherein the fourth opening in the waveguide allows the RF signals to propagate outside of the IC package through the air.

14. The IC package of claim 9 , wherein the first chip is further coupled to a first probe that extends into the cavity of the waveguide, and the first chip is further configured to exclusively communicate with the second and third chips by the first RF transceiver injecting the RF signals into the cavity of the waveguide via the first probe and by the first RF transceiver receiving the RF signals through the cavity of the waveguide via the first antenna.

15. The IC package of claim 9 , wherein the first, second, and third RF transceivers are configured to communicate with one another using at least one of time division multiplexing, frequency division multiplexing, code division multiplexing, or packet-based addressing.

16. An integrated chip (IC) package, comprising:

a first conductive layer over a second conductive layer with a cavity therebetween; and

a plurality of chips each comprising a radio frequency (RF) transceiver configured to transmit and receive radio frequency (RF) signals through the cavity;

wherein the plurality of chips of the IC package exclusively communicate with one another by transmitting and receiving the RF signals through the cavity; and

wherein a first probe of a first chip of the plurality of chips extends into the cavity at one-fourth of a wavelength of at least one of the RF signals from a first sidewall of the cavity and a second probe of a second chip of the plurality of chips extends into the cavity at a multiple of the wavelength of the at least one of the RF signals from the first probe.

17. The IC package of claim 16 , wherein one of the plurality of chips is configured to transmit a clock signal through the cavity to the other of the plurality of chips and the plurality of chips are configured to synchronize with one another based on the clock signal.

18. The IC package of claim 16 , wherein a third chip of the plurality of chips comprises an antenna positioned over an opening in the first conductive layer.

19. The IC package of claim 16 , wherein the plurality of chips are mounted on a substrate over the first conductive layer and the second conductive layer.

20. The IC package of claim 16 , wherein the plurality of chips are configured to transmit and receive the RF signals to another chip, at least partially through the air external to the IC package, via an opening in the first conductive layer, wherein the another chip is external to the IC package.