IP Library Granted Patent US 9,065,065
Granted Patent B2
US 9,065,065 · App. 13/734,837 · Granted Jun 23, 2015

Encapsulation for organic optoelectronic devices

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Quick Facts
Patent No.
US 9,065,065
App. No.
13/734,837
Granted
Jun 23, 2015
Kind
B2
Abstract

An organic optoelectronic device includes a substrate, an anode, a cathode, an active region comprising an organic material, an encapsulation that isolates the active region from an ambient environment, wherein the encapsulation comprises a housing, and a first hermetically sealed electrical path through the housing.

Claims (20)

1. A method of manufacturing an organic optoelectronic device, comprising:

providing a chip comprising a substrate, an anode, a cathode, and an active region including an organic material;

providing a housing;

substantially enclosing an edge of the chip with the housing; and

sealing the chip with the housing using a first barrier material, thereby forming an encapsulation that isolates the active region from an ambient environment,

further comprising:

providing a hermetically sealed electrical path through the housing,

wherein the housing is electrically conductive,

wherein the electrical path is electrically isolated from the housing, and

wherein the method further comprises electrically coupling one of the anode and the cathode to the housing.

2. A method of manufacturing an organic optoelectronic device, comprising:

providing a chip comprising a substrate, an anode, a cathode, and an active region including an organic material;

providing a housing;

substantially enclosing an edge of the chip with the housing; and

sealing the chip with the housing using a first barrier material, thereby forming an encapsulation that isolates the active region from an ambient environment, further comprising:

providing a hermetically sealed electrical path through the housing,

wherein the housing is electrically conductive,

wherein the electrical path is electrically isolated from the housing,

wherein the method further comprising coupling the anode to the housing, and

wherein the method further comprises coupling the organic optoelectronic device to a second optoelectronic device such that the electrically conductive housing forms a common anode with an electrically conductive housing of the second optoelectronic device.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded Mar 31, 2014
From: SOLVAY AMERICA, INC.
To: PLEXTRONICS, INC.
Reel/Frame 032568/0619 →
RELEASE OF SECURITY INTEREST Recorded Mar 31, 2014
From: SOLVAY AMERICA, INC.
To: PLEXTRONICS, INC.
Reel/Frame 032568/0641 →
RELEASE OF SECURITY INTEREST Recorded Mar 31, 2014
From: SOLVAY AMERICA, INC.
To: PLEXTRONICS, INC.
Reel/Frame 032568/0742 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 31, 2014
From: PLEXTRONICS, INC.
To: SOLVAY USA INC.
Reel/Frame 032568/0780 →
SECURITY AGREEMENT Recorded Jan 30, 2014
From: PLEXTRONICS, INC.
To: SOLVAY AMERICA, INC.
Reel/Frame 032141/0680 →
SECURITY AGREETMENT Recorded Sep 23, 2013
From: PLEXTRONICS, INC.
To: SOLVAY AMERICA, INC.
Reel/Frame 031347/0336 →