Systems for assembling electronic devices with internal moisture-resistant coatings
A system for assembling electronic devices includes at least one coating element for applying a moisture-resistant coating to surfaces of a device under assembly, or an electronic device under assembly. As components and one or more moisture-resistant coatings are added to the electronic device under assembly to form a finished electronic device, at least one surface on which the coating resides and, thus, at least a portion of the coating itself, is located internally within the finished electronic device. Methods for assembling electronic devices that include internally confined moisture-resistant coatings are also disclosed.
1. A system for assembling electronic devices, comprising:
a surface mount technology (SMT) element in which at least one surface mount device (SMD) is assembled with a circuit board to form an electronic device under assembly;
an assembly element in which electronic parts, user interface components, and housing components are assembled with the electronic device under assembly;
a first coating element in which a first moisture-resistant coating is applied to a first portion of the electronic device under assembly; and
a second coating element, separate from said first coating element, in which a second moisture-resistant coating is applied to a second portion of the electronic device under assembly, the second portion being different from the first portion.
2. The system of claim 1 , wherein the first coating element is positioned to apply a moisture-resistant coating to an SMD not yet assembled with the circuit board.
3. The system of claim 1 , wherein the first coating element is located along an assembly line.
4. The system of claim 3 , wherein the first coating element is positioned in sequence between the SMT element and the assembly element.
5. The system of claim 3 , wherein the first coating element is part of the assembly element.
6. The system of claim 3 , wherein the first coating element is positioned to apply a moisture-resistant coating to one or more of the at least one SMD prior to assembly of the one or at least one SMD with the circuit board by the SMT element.
7. The system of claim 1 , wherein the first coating element is located downstream from the assembly element.
8. The system of claim 7 , wherein the first coating element is configured to apply a moisture-resistant coating to an exterior or an interior of a finished electronic device.
9. The system of claim 8 , further comprising:
a masking element for masking areas of the exterior or the interior where the moisture-resistant coating is not desired.
10. The system of claim 1 , wherein the first coating element comprises an apparatus for depositing a polymer coating onto the first portion of the electronic device under assembly.
11. The system of claim 10 , wherein the first coating element comprises a molecular vapor diffusion apparatus.
12. The system of claim 10 , wherein the first coating element comprises a deposition apparatus for forming reactive species that polymerize on the electronic device under assembly.
13. The system of claim 12 , wherein the deposition apparatus is configured to vaporize at least one type of [2,2] paracyclophane, to pyrolyze the [2,2] paracyclophane to form p-xylylene intermediates and to enable the p-xylylene intermediates to polymerize on the electronic device under assembly to form a poly(p-xylylene) polymer on the electronic device under assembly.
14. The system of claim 1 , further comprising surface treatment element configured to prepare a surface of the electronic device under assembly for enhanced adhesion of the moisture-resistant coating.
15. The system of claim 1 , further comprising:
at least one coating inspection element located downstream from the first or second coating element.
16. The system of claim 1 , wherein the second coating element is positioned to apply a moisture-resistant coating between the circuit board and one or more of the at least one SMD.
17. The system of claim 1 , wherein at least one of the first and second coating elements is located off-line relative to the SMT element and the assembly element.
18. The system of claim 1 , further comprising:
a collection component configured to collect a plurality of electronic devices under assembly prior to feeding the plurality of electronic devices under assembly to the first or second coating element.