Method and apparatus for making a semiconductor device
View Patent ↗Disclosed is an apparatus and method for yield enhancement of making a semiconductor device. The apparatus for yield enhancement of making a semiconductor device comprises: a semiconductor device comprising an epitaxial layer in which a defect is included, and a photo-resistor on the epitaxial layer and covering the defect; an image recognition system to detect and identify a location of the defect; and an exposing module comprising a first light source to expose a part of the photo-resistor substantially corresponding to the detected defect identified by the image recognition system.
1. A method for yield enhancement of making a semiconductor device, comprising the steps of:
providing a semiconductor device comprising an epitaxial layer in which a defect is included;
coating a photo-resist on the epitaxial layer;
detecting and identifying a location of the defect by an image recognition system;
exposing a part of the photo-resist substantially corresponding to the detected defect identified by the image recognition system;
developing to remove the exposed part of the photo-resist;
removing a part of the epitaxial layer where the photo-resist is removed; and
forming a dielectric material substantially in a region where the epitaxial layer is removed,
wherein said removing the part of the epitaxial layer comprises an etching process.
2. The method as claimed in claim 1 , wherein the coating step is performed after the detecting step.
3. The method as claimed in claim 1 , wherein the detecting step and the exposing step are performed substantially at the same time.
4. A method for yield enhancement of making a semiconductor device, comprising the steps of:
providing a semiconductor device comprising an epitaxial layer in which a defect is included;
detecting and identifying a location of the defect by an image recognition system;
forming a photo-resist on the epitaxial layer, wherein a part of the photo-resist is removed to substantially correspond to the detected defect identified by the image recognition system;
removing a part of the epitaxial layer with the photo-resist; and
removing the photo-resist and forming a dielectric material in a region substantially corresponding to the part which the epitaxial layer is removed,
wherein said removing the part of the epitaxial layer comprises an etching process.
5. The method as claimed in claim 4 , further comprising forming an anti-reflective layer on the epitaxial layer and the dielectric material.
6. The method as claimed in claim 5 , further comprising forming an electrode disposed in the anti-reflective layer and on the epitaxial layer.
7. The method as claimed in claim 1 , further comprising providing a mask and exposing the photo-resist with the mask to expose a cutting line pattern on the photo-resist before the detecting step or after the exposing step, and the part of the photo-resist for the cutting line pattern is removed in the developing step.