Non-volatile semiconductor memory device
View Patent ↗A non-volatile semiconductor memory device has a semiconductor substrate, an element isolation region disposed in a surface of the semiconductor substrate, a well region disposed along one principal surface of the semiconductor substrate, source and drain regions arranged in the well region, a gate oxide film arranged on the surface of the semiconductor substrate between the source region and the drain region, a floating gate disposed on the gate oxide film, and an insulating film disposed on a surface of the floating gate. A control gate is capacitively coupled to the floating gate disposed through intermediation of the insulating film. A resistive element is serially connected to the control gate. Write characteristics of the non-volatile semiconductor memory device are improved as a result of a delay effect of the resistive element serially connected to the control gate.
1. A non-volatile semiconductor memory device, comprising:
a semiconductor substrate;
an element isolation region disposed in a surface of the semiconductor substrate;
an N-type well region disposed along one principal surface of the semiconductor substrate;
a P-type source region and a P-type drain region both arranged in the N-type well region;
a gate oxide film arranged on the surface of the semiconductor substrate between the P-type source region and the P-type drain region;
a floating gate disposed on the gate oxide film;
an insulating film disposed on a surface of the floating gate;
a control gate capacitively coupled to the floating gate disposed through intermediation of the insulating film; and
a resistive element serially connected to the control gate and having one end connected only to the control gate, a delay effect of the resistive element being utilized to increase a potential of the control gate so as to cancel out a decrease in floating gate potential caused by hot electrons injected in a writing operation.
2. A non-volatile semiconductor memory device according to claim 1 , wherein the resistive element connected to the control gate is used to generate a constant potential difference between a potential of the floating gate and a threshold potential of the non-volatile semiconductor memory device in the writing operation.
3. A non-volatile semiconductor memory device according to claim 1 , wherein the resistive element comprises a diffused resistor.
4. A non-volatile semiconductor memory device according to claim 1 , wherein the resistive element comprises a polycrystalline silicon resistor.
5. A non-volatile semiconductor memory device comprising:
a semiconductor substrate;
an element isolation region disposed in a surface of the semiconductor substrate;
a well region disposed along one principal surface of the semiconductor substrate;
a source region and a drain region both arranged in the well region;
a gate oxide film arranged on the surface of the semiconductor substrate between the source region and the drain region;
a floating gate disposed on the gate oxide film;
an insulating film disposed on a surface of the floating gate;
a control gate capacitively coupled to the floating gate disposed through intermediation of the insulating film; and
a resistive element serially connected to the control gate so that a delay effect of the resistive element increases a potential of the control gate and cancels out a decrease in a potential of the floating gate resulting from hot electrons injected in the floating gate during a write operation of the non-volatile semiconductor memory device, the resistive element having an end connected only to the control gate and another end connected to a variable voltage source.
6. A non-volatile semiconductor memory device according to claim 5 , wherein the resistive element is configured to generate a constant potential difference between the potential of the floating gate and a threshold potential of the non-volatile semiconductor memory device during the write operation.
7. A non-volatile semiconductor memory device according to claim 5 , wherein the resistive element comprises a diffused resistor.
8. A non-volatile semiconductor memory device according to claim 5 , wherein the resistive element comprises a polycrystalline silicon resistor.
9. A non-volatile semiconductor memory device comprising:
a semiconductor substrate;
an element isolation region disposed in a surface of the semiconductor substrate;
a well region disposed along one principal surface of the semiconductor substrate;
a source region and a drain region both arranged in the well region;
a gate oxide film arranged on the surface of the semiconductor substrate between the source region and the drain region;
a floating gate disposed on the gate oxide film;
an insulating film disposed on a surface of the floating gate;
a control gate capacitively coupled to the floating gate disposed through intermediation of the insulating film; and
a resistive element serially connected to the control gate for increasing a potential of the control gate due to a delay effect of the resistive element so as to cancel out a decrease in a potential of the floating gate caused by drain avalanche hot electrons (DAHEs) injected in the floating gate during a write operation of the non-volatile semiconductor memory device, thereby preventing weakening of an electric field between a pinch-off point and the drain of the non-volatile semiconductor memory device which leads to a decrease in an amount of DAHEs generated during the write operation, the resistive element having an end connected only to the control gate.
10. A non-volatile semiconductor memory device according to claim 9 , wherein the resistive element is configured to generate a constant potential difference between the potential of the floating gate and a threshold potential of the non-volatile semiconductor memory device during the write operation.
11. A non-volatile semiconductor memory device according to claim 9 , wherein the resistive element comprises a diffused resistor.
12. A non-volatile semiconductor memory device according to claim 9 , wherein the resistive element comprises a polycrystalline silicon resistor.
13. A non-volatile semiconductor memory device according to claim 1 , wherein another end of the resistive element is connected to a variable voltage source.
14. A non-volatile semiconductor memory device according to claim 9 , wherein another end of the resistive element is connected to a variable voltage source.