IP Library Granted Patent US 9,259,731
Granted Patent B2
US 9,259,731 · App. 13/744,596 · Granted Feb 16, 2016

Liquid reagent containing microchip and method of using the same, and packaged liquid reagent containing microchip

Inventors: Shun Momose (Kyoto, JP); Hidetaka Okada (Kyoto, JP)
Assignee: Rohm Co., Ltd.
B01L3/50273B01L3/502723B01L2200/141B01L2200/16B01L2300/041B01L2300/0816B01L2300/0864B01L2300/0867B01L2300/0887B01L2400/0409B65D75/5805Y10T436/25
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Quick Facts
Patent No.
US 9,259,731
App. No.
13/744,596
Granted
Feb 16, 2016
Kind
B2
Abstract

Provided is a liquid reagent containing microchip having a fluid circuit formed of a space inside thereof. Liquid present in the fluid circuit is transferred to a desired position in the fluid circuit by applying centrifugal force. The fluid circuit includes a reagent retaining portion for accommodating a liquid reagent. The microchip includes an air introduction path formed of a groove provided on an outer surface of the microchip and coupled to the reagent retaining portion for introducing air into the reagent retaining portion, and a sealing portion provided so as to be detachable from the microchip for sealing the air introduction path. A method of using the microchip and a packaged liquid reagent containing microchip using the microchip are also provided.

Claims (30)

1. A packaged liquid reagent containing microchip comprising a package and a liquid reagent containing microchip accommodated in said package, the microchip having a fluid circuit formed of a space inside thereof, in which liquid present in said fluid circuit is transferred to a desired position in said fluid circuit by applying centrifugal force,

said fluid circuit including a reagent retaining portion for accommodating a liquid reagent,

said microchip comprising:

a reagent inlet formed in one surface of the microchip, the reagent inlet coupled to the reagent retaining portion so that liquid reagent poured into the reagent inlet reaches the reagent retaining portion;

an air introduction path formed in said one surface of said microchip and coupled to said reagent retaining portion for introducing air into said reagent retaining portion; and

a sealing portion formed on said one surface and arranged so as to cover the reagent inlet and expose at least a portion of the air introduction path when the liquid present in the fluid circuit is transferred to a desired position in the fluid circuit by applying centrifugal force,

wherein:

said fluid circuit includes two or more reagent retaining portions for accommodating a liquid reagent,

said air introduction path consists of two or more first paths coupled to the respective reagent retaining portions,

said sealing portion is a sealing layer stacked on said outer surface of said microchip so as to cover said air introduction path, and

said sealing layer has a cut to allow a portion stacked on end portions of said two or more first paths to be cut off, and

said portion of said sealing layer stacked on the end portions of said two or more first paths is joined with said package.

2. A packaged liquid reagent containing microchip comprising a package and a liquid reagent containing microchip accommodated in said package, the microchip having a fluid circuit formed of a space inside thereof, in which liquid present in said fluid circuit is transferred to a desired position in said fluid circuit by applying centrifugal force,

said fluid circuit including a reagent retaining portion for accommodating a liquid reagent,

said microchip comprising:

a reagent inlet formed in one surface of the microchip, the reagent inlet coupled to the reagent retaining portion so that liquid reagent poured into the reagent inlet reaches the reagent retaining portion;

an air introduction path formed in said one surface of said microchip and coupled to said reagent retaining portion for introducing air into said reagent retaining portion; and

a sealing portion formed on said one surface and arranged so as to cover the reagent inlet and expose at least a portion of the air introduction path when the liquid present in the fluid circuit is transferred to a desired position in the fluid circuit by, applying centrifugal force

wherein:

said fluid circuit includes two or more reagent retaining portions, and

said air introduction path consists of two or more first paths coupled to the respective reagent retaining portions and one second path extending so as to be connected to all of said two or more first paths,

said sealing portion is a sealing layer stacked on said outer surface of said microchip so as to cover said air introduction path, and

said sealing layer has a cut to allow a portion stacked on an end portion of said second path to be cut off, and

said portion of said sealing layer stacked on the end portion of said second path is joined with said package.

3. A packaged liquid reagent containing microchip comprising a package and a liquid reagent containing microchip accommodated in said package, the microchip having a fluid circuit formed of a space inside thereof, in which liquid present in said fluid circuit is transferred to a desired position in said fluid circuit by applying centrifugal force,

said fluid circuit including a reagent retaining portion for accommodating a liquid reagent,

said microchip comprising:

a reagent inlet formed in one surface of the microchip, the reagent inlet coupled to the reagent retaining portion so that liquid reagent poured into the reagent inlet reaches the reagent retaining portion;

an air introduction path formed in said one surface of said microchip and coupled to said reagent retaining portion for introducing air into said reagent retaining portion; and

a sealing portion formed on said one surface and arranged so as to cover the reagent inlet and expose at least a portion of the air introduction path when the liquid present in the fluid circuit is transferred to a desired position in the fluid circuit by applying centrifugal force, wherein said sealing portion is a sealing layer stacked on said outer surface of said microchip so as to cover said air introduction path and wherein part of said sealing layer is composed of part of said package.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 1, 2019
From: ROHM CO., LTD.
To: HORIBA, LTD.
Reel/Frame 049049/0016 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 22, 2013
From: MOMOSE, SHUN; OKADA, HIDETAKA
To: ROHM CO., LTD.
Reel/Frame 029670/0255 →
Priority Claims (1)
JP 2012-015220 · Jan 27, 2012 · national
Continuity (1)
Related Publication 20130196442A1 · Aug 1, 2013