Integrated circuit and manufacturing method
View Patent ↗Disclosed is an integrated circuit comprising a substrate including at least one light sensor; an interconnect structure over the substrate; at least one passivation layer over the interconnect structure, said passivation layer including a first area over the at least one light sensor; and a gas sensor such as a moisture sensor at least partially on a further area of the at least one passivation layer, wherein the gas sensor comprises a gas sensitive layer in between a first electrode and a second electrode, the gas sensitive layer further comprising a portion over the first area. A method of manufacturing such an IC is also disclosed.
1. An integrated circuit comprising:
a substrate including at least one light sensor;
an interconnect structure over the substrate, the interconnect structure at least partially transparent to light such that light from outside the integrated circuit can reach the at least one light sensor;
at least one passivation layer over the interconnect structure, said passivation layer including a first area over the at least one light sensor;
and a gas sensor at least partially on a further area of the at least one passivation layer, wherein the gas sensor comprises a gas sensitive layer in between a first electrode and a second electrode, the gas sensitive layer further comprising a portion over the first area.
2. The integrated circuit of claim 1 , wherein the gas sensor is operable to detect moisture.
3. The integrated circuit of claim 2 , wherein the gas sensor is a relative humidity sensor.
4. The integrated circuit of claim 1 , wherein the gas sensitive layer is a polymer layer.
5. The integrated circuit of claim 4 , wherein the polymer layer is selected from the group consisting of polyacrylates, polymethacrylates, polyimides, polyamides, polyamines, polypyridines, polycarbonates, polyacetates, polystyrenes, polyacetylenes, polyanilines, polypyrroles, polythiophenes, poly(phenyl vinylene) and derivatives thereof.
6. The integrated circuit of claim 5 , wherein the polymer is a polyimide.
7. The integrated circuit of claim 1 , wherein the gas sensitive layer further comprises a dye in at least said portion.
8. The integrated circuit of any of claim 1 , wherein the light sensor is a photosensitive diode.
9. The integrated circuit of any of claim 1 , comprising a further light sensor in the substrate under an area of the at least one passivation layer uncovered by said portion.
10. The integrated circuit of claim 1 , further comprising a temperature sensor.
11. A packaging article comprising the integrated circuit of claim 1 .
12. An electronic device comprising the integrated circuit of claim 1 .