IP Library Granted Patent US 9,435,742
Granted Patent B2
US 9,435,742 · App. 13/746,102 · Granted Sep 6, 2016

Automated plasma cleaning system

Inventor: David Day (Boxford, MA)
Assignee: SciAps, Inc.
G01N21/718G01J3/443H01J37/32853H01J37/32972G01J3/0272G01J3/2823
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Quick Facts
Patent No.
US 9,435,742
App. No.
13/746,102
Granted
Sep 6, 2016
Kind
B2
Abstract

An analysis (e.g., LIBS) system includes a laser source generating a laser beam for creating a plasma at a location on a sample, and a spectrometer responsive to photons emitted by the sample at said location and having an output. A controller is responsive to a trigger signal and is configured to activate the laser source generating a series of laser pulses in a cleaning cycle, process the spectrometer output, and automatically terminate the cleaning cycle based on the spectrometer output.

Claims (40)

1. An analysis system comprising:

a laser source generating a laser beam for creating a plasma at a location on a sample;

a spectrometer responsive to photons emitted by the sample at said location and having an output; and

a controller subsystem, responsive to a trigger signal, and including a memory with computer code stored therein including programming to:

activate the laser source generating a series of laser pulses striking the sample location in a cleaning cycle,

process the resulting spectrometer output,

automatically terminate the cleaning cycle at said sample location based on the spectrometer output indicating a clean sample location and

initiate an analysis cycle at said sample location.

2. The system of claim 1 in which processing the spectrometer output includes analyzing the intensity of one or more peaks for multiple pulses.

3. The system of claim 2 in which terminating the cleaning cycle occurs when said intensity changes by less than a predetermined percentage over a predetermined number of laser pulses.

4. The system of claim 3 in which analyzing the intensity includes computing a rolling average of the intensity over multiple pulses.

5. The system of claim 1 further including an adjustable focusing lens for focusing the laser beam to a small spot size at said sample location.

6. The system of claim 5 in which the controller is further configured to adjust the focusing lens to produce a larger spot size during the cleaning cycle.

7. The system of claim 6 in which the controller is further configured to adjust said focusing lens based on the spectrometer output.

8. The system of claim 7 in which the controller is configured to adjust said focusing lens until a maximum or near maximum intensity is reached for at least one peak.

9. The system of claim 1 further including a movable optic configured to sequentially create a plasma at multiple locations on the sample.

10. The system of claim 9 in which the controller is further configured to adjust said optic and initiate and terminate the cleaning cycle at multiple locations on the sample.

11. An analysis method comprising:

in response to a trigger signal, activating a laser source generating a series of laser pulses creating a plasma at a location on a sample in a cleaning cycle;

detecting photons emitted by the sample at said location and producing an output;

processing the output;

automatically terminating the cleaning cycle based on the output indicating a clean sample location; and

initiating an analysis cycle at said location.

12. The method of claim 11 in which processing the output includes analyzing the intensity of one or more peaks for multiple pulses.

13. The method of claim 12 in which terminating the cleaning cycle occurs when said intensity changes by less than a predetermined percentage over a predetermined number of laser pulses.

14. The method of claim 13 in which analyzing the intensity includes computing a rolling average of the intensity over multiple pulses.

15. The method of claim 11 further including adjusting the focus of the laser pulses to a small spot size on said sample.

16. The method of claim 15 further including adjusting the focus to produce a larger spot size during the cleaning cycle.

17. The method of claim 15 including adjusting said focus based on the output.

18. The method of claim 17 including adjusting the focus until a maximum or near maximum intensity is reached for at least one peak.

19. The method of claim 11 further including creating a plasma at multiple locations on the sample.

20. The method of claim 19 further including initiating and terminating the cleaning cycle at multiple locations on the sample.

21. An analysis system comprising:

a laser source generating a laser beam for creating a plasma at a location on a sample;

a spectrometer responsive to photons emitted by the sample at said location and having an output; and

means, responsive to a trigger signal, for:

activating the laser source generating a series of laser pulses striking the sample location in a cleaning cycle,

processing the resulting spectrometer output,

automatically terminating the cleaning cycle based on the spectrometer output indicating a clean sample location; and

initiating an analysis cycle at said sample location.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Sep 24, 2024
From: FIRST-CITIZENS BANK & TRUST COMPANY
To: SCIAPS, INC.
Reel/Frame 068676/0175 →
RELEASE OF SECURITY INTEREST Recorded Aug 15, 2024
From: FIRST-CITIZENS BANK & TRUST COMPANY
To: SCIAPS, INC.
Reel/Frame 068303/0085 →
SECURITY INTEREST Recorded Mar 15, 2022
From: SCIAPS, INC.
To: SILICON VALLEY BANK
Reel/Frame 059268/0632 →
CHANGE OF ADDRESS Recorded May 5, 2016
From: SCIAPS, INC.
To: SCIAPS, INC.
Reel/Frame 038622/0030 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 21, 2013
From: DAY, DAVID
To: SCIAPS, INC.
Reel/Frame 030055/0549 →
Continuity (1)
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