Optoelectronic semiconductor device and the manufacturing method thereof
The present application provides an optoelectronic semiconductor device, comprising: a substrate; an optoelectronic system on the substrate; a barrier layer on the optoelectronic system, wherein the barrier layer thickness is not smaller than 10 angstroms; and an electrode on the barrier layer.
1. An optoelectronic semiconductor device, comprising:
a substrate;
an optoelectronic system on the substrate;
a barrier layer on the optoelectronic system, wherein the barrier layer thickness is not smaller than 10 angstroms; and
an electrode on the barrier layer;
wherein the optoelectronic semiconductor device has a first forward voltage at the room temperature and a second forward voltage after the optoelectronic semiconductor device is annealed with a temperature higher than the room temperature;
wherein a difference between the second forward voltage and the first forward voltage is smaller than 0.2 Volt.
2. The optoelectronic semiconductor device according to claim 1 , wherein the substrate is conductive.
3. The optoelectronic semiconductor device according to claim 1 , further comprising a passivation layer on a sidewall of the optoelectronic system.
4. The optoelectronic semiconductor device according to claim 3 , wherein the material of the passivation layer comprises single metal oxides, complex oxides, or non-conductive compound nitrides.
5. The optoelectronic semiconductor device according to claim 4 , wherein the material of the passivation layer comprises SiN x .
6. The optoelectronic semiconductor device according to claim 1 , wherein the material of the barrier layer comprises metal nitride.
7. The optoelectronic semiconductor device according to claim 6 , wherein the material of the barrier layer comprises TiN x .
8. The optoelectronic semiconductor device according to claim 1 , wherein the optoelectronic system comprises a first conductivity type layer, a conversion unit, and a second conductivity type layer.
9. The optoelectronic semiconductor device according to claim 1 , wherein the material of the optoelectronic system contains one or more elements selected from the group consisting of Ga, Al, In, As, P, N, and Si.
10. The optoelectronic semiconductor device according to claim 1 , wherein the annealing temperature is greater than 150° C.
11. The optoelectronic semiconductor device according to claim 1 , wherein the optoelectronic semiconductor device is annealed in one or more times.
12. The optoelectronic semiconductor device according to claim 1 , wherein the first forward voltage and the second forward voltage are measured when 350 mA current is applied to the optoelectronic semiconductor device.