Imaging apparatus, manufacturing method thereof and imaging display system

1. An imaging apparatus including a sensor substrate, the sensor substrate comprising:

photoelectric conversion devices on a substrate;

driving devices on the substrate, which respectively correspond to the photoelectric conversion devices;

signal lines for reading imaging signals obtained in the photoelectric conversion devices through the corresponding driving devices, respective ones of the signal lines having two separate parts including a first signal line part and a second signal line part; and

relay electrodes that electrically connect and relay between the driving devices and the corresponding signal lines, respective ones of the relay electrodes being disposed over the corresponding first signal line part and the corresponding second signal line part, wherein

the photoelectric conversion devices are PIN-type photodiodes respectively including a lower electrode, a photoelectric conversion layer, and an upper electrode stacked in this order,

the driving devices are thin-film transistors respectively including a gate electrode, a source electrode disposed between the corresponding first signal line part and the corresponding second signal line part, and a drain electrode electrically connected to the corresponding lower electrode, and

the relay electrodes are respectively electrically connected, through a plurality of contact holes, to each of the corresponding source electrode, the corresponding first signal line part, and the corresponding second signal line part.

2. The imaging apparatus according to claim 1 ,

wherein

the relay electrode is formed in the same layer as the corresponding lower electrode.

3. The imaging apparatus according to claim 1 ,

wherein the signal line is formed in the same layer as the corresponding gate electrode.

4. The imaging apparatus according to claim 1 ,

wherein the relay electrode is formed on an upper layer side of the corresponding signal line, the corresponding source electrode, the corresponding drain electrode and the corresponding gate electrode.

5. The imaging apparatus according to claim 1 ,

wherein the relay electrode is formed in the vicinity of the corresponding driving device of each photoelectric conversion device.

6. The imaging apparatus according to claim 1 , further comprising:

a waveform conversion member arranged on the sensor substrate and performing wavelength conversion of an incident radiation ray into a sensitivity range of the photoelectric conversion device, which is configured as a radiation imaging apparatus.

7. The imaging apparatus according to claim 6 ,

in which the radiation ray is an X-ray.

8. An imaging display system comprising:

an imaging apparatus having a sensor substrate; and

a display device performing image display based on imaging signals obtained by the imaging apparatus,

the sensor substrate comprising:

photoelectric conversion devices on a substrate;

driving devices on the substrate, which respectively correspond to the photoelectric conversion devices;

signal lines for reading imaging signals obtained in the photoelectric conversion devices through the corresponding driving devices, respective ones of the signal lines having two separate parts including a first signal line part and a second signal line part; and

relay electrodes that electrically connect and relay between the driving devices and the corresponding signal lines, respective ones of the relay electrodes being disposed over the corresponding first signal line part and the corresponding second signal line part, wherein

the photoelectric conversion devices are PIN-type photodiodes respectively including a lower electrode, a photoelectric conversion layer, and an upper electrode stacked in this order,

the driving devices are thin-film transistors respectively including a gate electrode, a source electrode disposed between the corresponding first signal line part and the corresponding second signal line part, and a drain electrode electrically connected to the corresponding lower electrode, and

the relay electrodes are respectively electrically connected, through a plurality of contact holes, to each of the corresponding source electrode, the corresponding first signal line part, and the corresponding second signal line part.

9. A manufacturing method of an imaging apparatus including forming a sensor substrate, the process of forming the sensor substrate comprising:

forming photoelectric conversion devices on a substrate;

forming driving devices on the substrate, which respectively correspond to the photoelectric conversion devices;

forming signal lines for reading imaging signals obtained in the photoelectric conversion devices through the corresponding driving devices, respective ones of the signal lines having two separate parts including a first signal line part and a second signal line part; and

forming relay electrodes that electrically connect and relay between the driving devices and the corresponding signal lines, respective ones of the relay electrodes being disposed over the corresponding first signal line part and the corresponding second signal line part, wherein

the photoelectric conversion devices are PIN-type photodiodes respectively including a lower electrode, a photoelectric conversion layer, and an upper electrode stacked in this order,

the driving devices are thin-film transistors respectively including a gate electrode, a source electrode disposed between the corresponding first signal line part and the corresponding second signal line part, and a drain electrode electrically connected to the corresponding lower electrode, and

the relay electrodes are respectively electrically connected, through a plurality of contact holes, to each of the corresponding source electrode, the corresponding first signal line part, and the corresponding second signal line part.