IP Library Granted Patent US 9,030,806
Granted Patent B2
US 9,030,806 · App. 13/749,737 · Granted May 12, 2015

Polymerization method for preparing conductive polymer

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Quick Facts
Patent No.
US 9,030,806
App. No.
13/749,737
Granted
May 12, 2015
Kind
B2
Abstract

A improved process for preparing a conductive polymer dispersion is provided as is an improved method for making capacitors using the conductive polymer. The process includes providing a monomer solution and shearing the monomer solution with a rotor-stator mixing system comprising a perforated stator screen having perforations thereby forming droplets of said monomer. The droplets of monomer are then polymerized during shearing to form the conductive polymer dispersion.

Claims (30)

1. A process for preparing a conductive polymer dispersion comprising:

providing a monomer solution;

shearing said monomer solution with a rotor-stator mixing system comprising a perforated stator screen having perforations thereby forming droplets of said monomer;

polymerizing said droplets of said monomer during said shearing to form said conductive polymer dispersion wherein said polymerization of said droplets of said monomer is in the presence of at least one steric stabilizer.

2. The process for preparing a conductive polymer dispersion of claim 1 wherein said monomer solution further comprises an oxidant.

3. The process for preparing a conductive polymer dispersion of claim 1 wherein said perforations have an equivalent diameter of at least 0.25 mm.

4. The process for preparing a conductive polymer dispersion of claim 3 wherein said perforations have an equivalent diameter of no more than 6 mm.

5. The process for preparing a conductive polymer dispersion of claim 4 wherein said perforations have an equivalent diameter of no more than 3 mm.

6. The process for preparing a conductive polymer dispersion of claim 1 wherein said polymerizing of said monomer is in the presence of at least one anion.

7. The process for preparing a conductive polymer dispersion of claim 6 wherein said anion is a polyanion.

8. The process for preparing a conductive polymer dispersion of claim 7 wherein said polyanion is polystyrene sulfonic acid.

9. The process for preparing a conductive polymer dispersion of claim 8 wherein said polystyrene sulfonic acid has a molecular weight of at least 500 to no more than 500,000.

10. The process for preparing a conductive polymer dispersion of claim 1 wherein said shearing during polymerization is at a shear rate of at least 10,000 to no more than 800,000 sec −1 .

11. The process for preparing a conductive polymer dispersion of claim of claim 10 wherein shear rate is at least 40,000, to no more than 75,000 sec −1 .

12. The process for preparing a conductive polymer dispersion of claim 1 wherein said dispersion has a percent solids of at least 1.0 wt % to no more than 5 wt %.

13. The process for preparing a conductive polymer dispersion of claim 12 wherein said dispersion has a percent solids of at least 1.3%.

14. The process for preparing a conductive polymer dispersion of claim 13 wherein said dispersion has a percent solids of at least 1.7%.

15. The process for preparing a conductive polymer dispersion of claim 1 wherein said dispersion has a viscosity of at least 200 cP @20 RPM to no more than 4000 cP @20 RPM.

16. The process for preparing a conductive polymer dispersion of claim 15 wherein said dispersion has a viscosity of at least 2000 cP @20 RPM.

17. The process for preparing a conductive polymer dispersion of claim 1 wherein said conductive polymer dispersion comprises a conductive polymer with an average particle size below 200 nm.

18. The process for preparing a conductive polymer dispersion of claim 17 wherein said conductive polymer has an average particle size below 150 nm.

19. The process for preparing a conductive polymer dispersion of claim 18 wherein said conductive polymer has an average particle size below 100 nm.

20. The process for preparing a conductive polymer dispersion of claim 1 wherein said perforations have a minimum dimension of at least 1 mm to no more than about 3 mm.

21. The process for preparing a conductive polymer dispersion of claim 20 wherein said perforations have a minimum dimension of at least 1.2 mm to no more than about 2.5 mm.

22. The process for preparing a conductive polymer dispersion of claim 1 wherein said hole equivalent diameters are at least 1.2 mm to no more than about 6 mm.

23. The process for preparing a conductive polymer dispersion of claim 1 wherein said polymerizing is in inert atmosphere.

24. The process for preparing a conductive polymer dispersion of claim 1 wherein said steric stabilizer has a hydrophilic/lipophilic balance of at least 10.

25. The process for preparing a conductive polymer dispersion of claim 1 wherein said steric stabilizer is selected from the group consisting of polyethylene oxide, fully hydrolyzed poly(vinyl alcohol), partially hydrolyzed poly(vinyl alcohol), poly(vinyl pyrollidone), hydroxyethyl cellulose and polyethylene oxide copolymers and their derivatives.

26. The process for preparing a conductive polymer dispersion of claim 25 wherein said steric stabilizer is polyethylene oxide.

27. The process for preparing a conductive polymer dispersion of claim 1 wherein said conductive polymer dispersion comprises at least one optionally substituted polymer selected from polypyrrole, polyaniline and polythiophene.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Nov 8, 2018
From: BANK OF AMERICA, N.A.
To: KEMET CORPORATION,; KEMET ELECTRONICS CORPORATION; KEMET BLUE POWDER CORPORATION
Reel/Frame 047450/0926 →
SECURITY AGREEMENT Recorded May 22, 2017
From: KEMET CORPORATION; KEMET ELECTRONICS CORPORATION; KEMET BLUE POWDER CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 042523/0639 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 25, 2013
From: CHACKO, ANTONY P.; SHI, YARU; OLS, JOHN
To: KEMET ELECTRONICS CORPORATION
Reel/Frame 029690/0981 →