Granted Patent B2

US 9,658,000 · App. 13/750,078 · Granted May 23, 2017

Abstract

Claims (25)

1. A thermal connector comprising;

a heat sink having a recess;

a heat spreader that fits into the recess of the heat sink;

a spring, comprising a body portion that is connected flush with the heat spreader and a plurality of legs angled away from the heat spreader and towards the heat sink so that the plurality of legs contact the heat sink when the heat spreader is fit into the recess of the heat sink;

a flexible membrane attached to the heat sink and to the heat spreader, so that the membrane seals off the recess; and

a phase change material that fills the void defined by the heat sink, flexible membrane, and heat spreader, wherein the phase change material holds the spring compressed to its smallest height so that when the thermal connector is heated and the phase change material is melted, the heat spreader is pushed by the spring away from the heat sink and into contact with a heat generating component positioned adjacent to the heat sink;

wherein the flexible membrane allows the phase change material to expand in response to the movement of the heat spreader away from the heat sink.

2. The thermal connector of claim 1 , wherein the thermal connector makes a thermal connection between the heat spreader and the heat generating component.

3. The thermal connector of claim 1 wherein the flexible membrane is a silicone or urethane polymer.

4. The thermal connector of claim 1 wherein the phase change material is a low melting alloy.

5. The thermal connector of claim 1 , wherein the phase change material has a melting point between about 40° C. to 250° C. and a thermal conductivity between about 20 W/mK and 400 W/mK.

6. The thermal connector of claim 1 , wherein the phase change material has a melting point between about 60° C. to 160° C. and a thermal conductivity between about 30 W/mK and 100 W/mK.

7. The thermal connector of claim 4 wherein the low melting alloy has a melting point of about 118° C. and a thermal conductivity of about 3 5 W/mK.

8. The thermal connector of claim 4 wherein the heat generating component is an electrical device component.

9. The thermal connector of claim 1 , wherein the spring biases the heat spreader within a range of 0.1 mm to 3 mm.

10. A method to thermally connect a heat generating component and a heat sink having a gap there between comprising the steps:

providing a thermal connector comprising:

a heat spreader and a spring, the spring comprising a body portion that is connected flush with the heat spreader and a plurality of legs angled away from the heat spreader;

a low melting point alloy surrounding the spring, wherein (i) when the alloy is in a melted state, the spring may move the heat spreader, and (ii) when the alloy is in a hardened state, the spring may not move the heat spreader;

a flexible membrane that contains the low melting point alloy within the gap and allows the alloy to contract and expand in response to the movement of the heat spreader towards and away from the heat sink;

melting the alloy to a melted state;

compressing the spring to its smallest height;

cooling the alloy to a hardened state to hold the spring in compression;

placing the thermal connector in the gap between the heat sink and the heat generating component; and

heating the alloy above a melting temperature so that the alloy melts allowing the spring to move the heat spreader away from the heat sink and into thermal contact with the heat generating component.

Assignments (13)