Memristor using a transition metal nitride insulator

1. Apparatus, in which a path for electric current has at least one state of higher conductance and at least one state of lower conductance, comprising at least one switching layer interposed in said path between at least a first and a second conducting electrode element, wherein said switching layer comprises a metal oxynitride and is switchable between said states.

2. Apparatus of claim 1 , wherein at least one of the electrode elements comprises aluminum, titanium, titanium nitride, or tungsten.

3. Apparatus of claim 1 , wherein the switching layer comprises aluminum oxynitride and/or titanium oxynitride.

4. Apparatus of claim 1 , wherein the switching layer is at least 2 nm in thickness.

5. Apparatus of claim 1 , wherein the switching layer is at least 2 nm, but not more than 100 nm, in thickness.

6. Apparatus of claim 1 , wherein the switching layer is the product of exposing an aluminum nitride film to an oxidizing atmosphere.

7. Apparatus of claim 1 , wherein at least a portion of the switching layer comprises an oxynitride of aluminum or titanium, having an oxygen mole fraction of at least 5%.

8. Apparatus of claim 1 , wherein at least one of the electrode elements is in direct contact with a portion of the switching layer composed of the metal oxynitride.

9. Apparatus of claim 1 , wherein oxygen is distributed in the switching layer such that at least one near-surface region of the switching layer adjacent a corresponding one of the electrode elements consists of a metal oxynitride containing a sufficient mole fraction of oxygen to inject oxygen anions into deeper portions of the switching layer under stimulation by a voltage of sufficient magnitude.

10. A method for fabricating a resistive switching device, comprising:

forming a first conductive metal layer on a substrate;

forming a switching layer comprising a metal oxynitride over the first conductive metal layer in conductive electrical contact therewith; and

forming a second conductive metal layer over the switching layer in conductive electrical contact therewith;

wherein said layers are formed such that a path for electric current having at least one state of higher conductance and at least one state of lower conductance is defined between the first and second conductive metal layers.

11. The method of claim 10 , wherein forming the switching layer comprises:

depositing a metal nitride layer; and

exposing the deposited metal nitride layer to an oxygen-containing atmosphere.

12. The method of claim 10 , wherein forming the switching layer comprises co-depositing at least one metal with species that comprise oxygen and nitrogen.

13. The method of claim 10 , wherein forming the switching layer comprises depositing a layer of aluminum nitride and partially oxidizing the deposited aluminum nitride layer to form said metal oxynitride.

14. The method of claim 10 , wherein forming the switching layer comprises depositing a layer of aluminum oxynitride.

15. The method of claim 10 , further comprising electroforming the switching layer with a voltage sweep applied across the switching layer that reaches sufficient magnitude to cause said layer to stably exhibit a current-voltage curve of a form that is characteristic of bipolar switching.