IP Library Granted Patent US 9,137,916
Granted Patent B2
US 9,137,916 · App. 13/751,350 · Granted Sep 15, 2015

Method and apparatus for potting an electronic device

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,137,916
App. No.
13/751,350
Granted
Sep 15, 2015
Kind
B2
Abstract

Method and apparatus for potting an electronic device. In one embodiment, the method comprises providing an enclosure having a first inner volume with the electronic device disposed therein; placing a fill control element within the enclosure such that a second inner volume of the fill control element is fluidly coupled to the first inner volume; and filling a remaining portion of the first inner volume, the remaining portion not occupied by the electronic device or the fill control element, with a sealant such that air is trapped within at least a first portion of the second inner volume.

Claims (27)

1. A potted electronic device comprising:

a container having an electronic device and a fill control element disposed therein; and

a sealant that substantially fills an inner volume of the container except for a portion of the inner volume defined by the fill control element, wherein the sealant is not physically obstructed from entering the portion of the inner volume.

2. The potted electronic device of claim 1 , wherein air is trapped within an inner volume of the fill control element.

3. The potted electronic device of claim 1 , further comprising at least one support for maintaining the electronic device spaced apart from the container.

4. The potted electronic device of claim 1 , wherein the sealant is at least one of epoxy, polyurethane, or silicone.

5. The potted electronic device of claim 1 , further comprising a lid disposed atop the container.

6. The potted electronic device of claim 5 , wherein the lid retains the fill control element against the electronic device.

7. The potted electronic device of claim 1 , wherein the container is at least partially formed from metal and the fill control element is formed from plastic.

8. The potted electronic device of claim 1 , wherein the container is formed from plastic and the fill control element is at least partially formed from metal.

9. The potted electronic device of claim 1 , further comprising at least two electrical leads for coupling the electronic device to a device external to the container.

10. A potted electronic device comprising:

a container having an electronic device and a fill control element disposed therein;

a sealant that substantially fills an inner volume of the container except for a portion of the inner volume defined by the fill control element; and

a lid disposed atop the container, wherein the lid retains the fill control element against the electronic device.

11. The potted electronic device of claim 10 , wherein air is trapped within an inner volume of the fill control element.

12. The potted electronic device of claim 10 , further comprising at least one support for maintaining the electronic device spaced apart from the container.

13. The potted electronic device of claim 10 , wherein the sealant is at least one of epoxy, polyurethane, or silicone.

14. The potted electronic device of claim 10 , further comprising at least two electrical leads for coupling the electronic device to a device external to the container.

15. A potted electronic device comprising:

a container having an electronic device and a fill control element disposed therein; and

a sealant that substantially fills an inner volume of the container except for a portion of the inner volume defined by the fill control element, wherein the container is formed from plastic and the fill control element is at least partially formed from metal.

16. The potted electronic device of claim 15 , wherein air is trapped within an inner volume of the fill control element.

17. The potted electronic device of claim 15 , further comprising at least one support for maintaining the electronic device spaced apart from the container.

18. The potted electronic device of claim 15 , wherein the sealant is at least one of epoxy, polyurethane, or silicone.

19. The potted electronic device of claim 15 , further comprising a lid disposed atop the container.

20. The potted electronic device of claim 19 , wherein the lid retains the fill control element against the electronic device.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded May 5, 2026
From: OBSIDIAN AGENCY SERVICES, INC.
To: ENPHASE ENERGY, INC.
Reel/Frame 075546/0734 →
RELEASE OF SECURITY INTEREST Recorded Feb 26, 2020
From: FLEXTRONICS INDUSTRIAL, LTD.; FLEXTRONICS AMERICA, LLC
To: ENPHASE ENERGY, INC.
Reel/Frame 052022/0954 →
CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY NAME PREVIOUSLY RECORDED AT REEL: 041936 FRAME: 0109. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Apr 17, 2017
From: ENPHASE ENERGY, INC.
To: FLEXTRONICS INDUSTRIAL, LTD; FLEXTRONICS AMERICA, LLC
Reel/Frame 043339/0856 →
SECURITY INTEREST Recorded Dec 30, 2016
From: ENPHASE ENERGY, INC.
To: OBSIDIAN AGENCY SERVICES, INC.
Reel/Frame 041225/0509 →
SECURITY INTEREST Recorded Dec 30, 2016
From: ENPHASE ENERGY, INC.
To: FLEXTRONICS AMERICA, LLC
Reel/Frame 041936/0109 →
SECURITY AGREEMENT Recorded Dec 30, 2016
From: ENPHASE ENERGY, INC.
To: FLEXTRONICS INDUSTRIAL, LTD
Reel/Frame 041958/0820 →
SECURITY INTEREST Recorded Dec 28, 2016
From: ENPHASE ENERGY, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS AGENT
Reel/Frame 041210/0283 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2013
From: FORNAGE, MARTIN
To: ENPHASE ENERGY, INC.
Reel/Frame 029711/0726 →