Integrated circuit
View Patent ↗Disclosed is an integrated circuit comprising a substrate ( 10 ) including semiconductor devices and a metallization stack ( 20 ) over said substrate for interconnecting said devices, the metallization stack comprising a cavity ( 36 ), and a thermal conductivity sensor comprising at least one conductive portion ( 16, 18 ) of said metallization stack suspended in said cavity. A method of manufacturing such an IC is also disclosed.
1. An integrated circuit comprising:
a substrate including semiconductor devices in or on the substrate; and
a metallization stack over said semiconductor devices and over said substrate for interconnecting said semiconductor devices, the metallization stack comprising a cavity, and a thermal conductivity sensor comprising at least one conductive portion of said metallization stack suspended in said cavity;
wherein the metallization stack comprises a multi-layered support structure for supporting at least the conductive portion.
2. The integrated circuit of claim 1 , wherein at least some of the semiconducting devices define a control circuit for determining the resistance of the at least one conductive portion at a predefined voltage or current across the conductive portion.
3. The integrated circuit of claim 1 , wherein the at least one conductive portion is formed in a metal layer or a via layer of the metallization stack.
4. The integrated circuit of claim 1 , wherein the metallization stack comprises a metal plate located in between the at least one conductive portion and the substrate.
5. The integrated circuit of claim 1 , wherein the thermal conductivity sensor comprises at least a pair of conductive portions including a sensing element and a heating element suspended in said cavity, said sensing element being thermally coupled to the heating element.
6. The integrated circuit of claim 5 , wherein the sensing element and the heating element are formed in the same layer of the metallization stack.
7. The integrated circuit of claim 6 , wherein the sensing element and the heating element are interdigitated.
8. The integrated circuit of claim 5 , wherein the sensing element and the heating element are formed in different layers of the metallization stack.
9. The integrated circuit of claim 6 , wherein at least one of the sensing element and the heating element is formed in a via layer.
10. The integrated circuit of claim 5 , wherein the thermal conductivity sensor further comprises a further sensing element suspended in said cavity at a distance to the heating element that is different to the distance between the heating element and the sensing element.
11. The integrated circuit of claim 5 , wherein the heating element has a meandering shape.
12. The integrated circuit of claim 1 , wherein the conductive portion has a meandering shape.
13. An article comprising the integrated circuit of claim 1 .
14. An integrated circuit comprising:
a substrate including semiconductor devices in or on the substrate; and
a metallization stack over said semiconductor devices and over said substrate for interconnecting said semiconductor devices, the metallization stack comprising multiple metal layers separated by a dielectric layer, the metallization layer including a thermal conductivity sensor formed therein, wherein at least one portion of the thermal conductivity sensor is formed in a metal layer of the metallization layer that is suspended in a cavity formed within the metallization layer;
wherein the metallization stack comprises a multi-layered support structure for supporting at least the conductive portion.
15. The integrated circuit device of claim 14 wherein the metal layer, in which the at least one portion of the thermal conductivity sensor is formed, is a tungsten layer.