Method of making a 3D integrated circuit
View Patent ↗A method for manufacturing an integrated circuit, including the steps of forming first transistors on a first semiconductor layer; depositing a first insulating layer above the first semiconductor layer and the first transistors, and leveling the first insulating layer; depositing a conductive layer above the first insulating layer, and covering the conductive layer with a second insulating layer; bonding a semiconductor wafer to the second insulating layer; thinning the semiconductor wafer to obtain a second semiconductor layer; and forming second transistors on the second semiconductor layer.
1. A method for manufacturing an integrated circuit, comprising the steps of:
forming first transistors on a first semiconductor layer;
depositing a first insulating layer above the first semiconductor layer and the first transistors;
leveling the first insulating layer;
depositing a conductive layer above the first insulating;
covering the conductive layer with a second insulating layer;
bonding a semiconductor wafer to the second insulating layer;
thinning the semiconductor wafer to obtain a second semiconductor layer; and
forming second transistors on the second semiconductor layer.
2. The method of claim 1 , further comprising, after the step of forming of the second transistors on the second semiconductor layer, a step of depositing of a third insulating layer on the second semiconductor layer and the second transistors, and a step of forming of an electrical contact crossing the third insulating layer and the second insulating layer to make contact with the conductive layer.
3. The method of claim 1 , wherein the first insulating layer is made of silicon oxide and has a thickness ranging between 20 and 100 nm between the gates of the first transistors and the conductive layer, and wherein the second insulating layer is made of silicon oxide and has a thickness ranging between 10 and 25 nm.
4. The method of claim 1 , wherein the conductive layer is made of a metallic material selected from the group comprising titanium, tantalum, and tungsten.
5. The method of claim 1 , wherein the conductive layer is made of doped polysilicon.
6. The method of claim 1 , further comprising, before the step of bonding the semiconductor wafer to the second insulating layer, a step of forming of a fourth insulating layer on the semiconductor wafer.
7. The method of claim 1 , wherein the first semiconductor layer is the upper portion of another semiconductor wafer.
8. An integrated circuit comprising, in stacked fashion:
a first semiconductor layer comprising at least one first transistor;
a first insulating layer covering the at least one first transistor;
a conductive layer covering the first insulating layer;
a second insulating layer covering the conductive layer; and
a second semiconductor layer covering the second insulating layer and comprising at least one second transistor.
9. The integrated circuit of claim 8 , further comprising:
a third insulating layer covering the at least one second transistor; and
a conductive via extending through the second and third insulating layers to make electrical contact with he conductive layer, said conductive via configured to be connected to a pad capable of receiving a bias voltage.
10. The method of claim 1 , further comprising forming a conductive via extending through the second insulating layer to make electrical contact with the conductive layer.
11. The method of claim 1 , further comprising configuring the conductive layer for having an effect on a threshold voltage of the second transistors.
12. The method of claim 11 , wherein configuring comprises forming a conductive via extending through the second insulating layer to make electrical contact with the conductive layer for the purpose of applying a biasing voltage to the conductive layer.
13. The method of claim 1 , wherein the first semiconductor layer is a portion of a silicon on insulator substrate.
14. A method for manufacturing an integrated circuit, comprising the steps of:
forming first transistors on a first semiconductor layer;
depositing a first insulating layer above the first semiconductor layer and the first transistors;
depositing a conductive layer directly on a top surface of the first insulating layer;
covering a top surface of the conductive layer with a second insulating layer;
bonding a first surface of a semiconductor wafer to a top surface of the second insulating layer;
thinning a second surface of the semiconductor wafer to obtain a second semiconductor layer;
forming second transistors on the second semiconductor layer;
depositing a third insulating layer above the second semiconductor layer and the second transistors; and
forming a first electrical via extending through the second and third insulating layer to make electrical contact with the conductive layer.
15. The method of claim 14 , further comprising:
forming second electrical vias extending through the first, second and third insulating layers to make electrical contact with the first transistors; and
forming third electrical vias extending through the third insulating layer to make electrical contact with the second transistors.
16. The method of claim 14 , wherein the first surface of the semiconductor wafer that is bonded to the top surface of the second insulating layer is a surface of a fourth insulating layer on the semiconductor substrate layer.
17. The method of claim 14 , wherein the conductive layer is made of tungsten.
18. The method of claim 14 , wherein the conductive layer is made of doped polysilicon.
19. The method of claim 14 , further comprising configuring the conductive layer for having an effect on a threshold voltage of the second transistors.
20. The method of claim 19 , wherein configuring comprises configuring the first conductive via for the purpose of applying a biasing voltage to the conductive layer.