Small form-factor pluggable optical transceiver
View Patent ↗A small form-factor pluggable (SFP) optical transceiver includes a casing configured to accommodate optical and electrical devices. During normal operation, the casing is connected to a switchboard via a connector in the switchboard, and the optical devices are outside the switchboard, thereby exposing optical devices sensitive to high temperature to the outside air, reducing the operational temperature of the optical device portion relative to the heated portion inside the switchboard. Thus, the present SFP optical transceiver advantageously improves operational performance and extends the life of the device. Also, the present SFP optical transceiver having the optical device portion outside the switchboard advantageously improves the cooling performance for the optical device portion.
1. A small form-factor pluggable optical transceiver, comprising:
a switchboard having a connector; and
a casing connected to said switchboard via said connector, said casing configured to accommodate optical devices and electrical devices and comprising an internal thermal isolator configured to divide the casing into a first cavity that contains said optical devices and a second cavity that contains said electrical devices, wherein said casing is configured to position said optical devices outside said switchboard during normal operation.
2. The transceiver of claim 1 , wherein said second cavity is positioned inside the switchboard.
3. The transceiver of claim 1 , wherein the internal thermal isolator has an electrical feed therein to electrically connect one side of said internal thermal isolator close to said first cavity with another side of said internal thermal isolator close to said second cavity.
4. The transceiver of claim 1 , wherein said internal thermal insulator comprises a ceramic material.
5. The transceiver of claim 1 , wherein said casing comprises a cover and a base close and/or adjacent to said thermal isolator.
6. The transceiver of claim 5 , wherein said casing includes air holes configured to communicate said second cavity with air outside said casing.
7. The transceiver of claim 1 , wherein said casing has a tapered end at an inner bottom portion of said casing, and a bottom portion of said thermal isolator has a groove compatible with said tapered end.
8. The transceiver of claim 1 , wherein said casing comprises a de-latching unit on a top surface of said casing.
9. The transceiver of claim 8 , wherein said de-latching unit is configured to latch said casing and said switchboard, and release said casing from said switchboard.
10. A small form-factor pluggable optical transceiver, comprising:
a first cavity having a plurality of optical devices therein;
a second cavity having one or more electrical devices therein; and
a casing enclosing the optical devices and the electrical devices, comprising an internal thermal isolator configured to divide the casing into the first cavity and the second cavity, and isolate or prevent heat from said electrical devices in said second cavity from transferring into said first cavity or affecting said optical devices in said first cavity, wherein said casing has a tapered end at an inner bottom portion of said casing, and a bottom portion of said thermal isolator has a groove compatible with said tapered end.
11. The transceiver of claim 10 , wherein said first cavity is outside a switchboard or other system case during normal operation.
12. The transceiver of claim 10 , further comprising a thermal isolator having an electrical feed therein to electrically connect one side of said thermal isolator close to or facing said first cavity with another side of said thermal isolator close to or facing said second cavity.
13. The transceiver of claim 12 , wherein said thermal isolator comprises a thermal insulating layer or a ceramic material.
14. The transceiver of claim 10 , wherein said casing includes air holes configured to communicate said second cavity with air outside said casing.
15. The transceiver of claim 10 , wherein said casing comprises a de-latching unit on a top surface of said casing.
16. The transceiver of claim 1 , wherein the first cavity is configured to operate at or be in thermal equilibrium with a case temperature of the switchboard.
17. The transceiver of claim 10 , wherein the first cavity is configured to operate at a temperature at least 20° C. less than that of the second cavity.
18. The transceiver of claim 8 , wherein the de-latching unit is located over or on top of the first cavity.
19. The transceiver of claim 15 , wherein the de-latching unit is located over or on top of the first cavity.