Semiconductor device and methods of manufacturing semiconductor devices
View Patent ↗This application relates to a semiconductor device comprising a semiconductor chip, a molded body covering the semiconductor chip, wherein the molded body comprises an array of molded structure elements, and first solder elements engaged with the molded structure elements.
1. A semiconductor device comprising:
a semiconductor chip;
a molded body at least partially covering the semiconductor chip, the molded body including at least one cone-shaped protrusion, wherein the semiconductor chip includes at least a surface having a first connection element, the surface having the first connection element being uncovered by the molded body, the molded body having a mold surface, the mold surface and the surface having the first connection element defining a coplanar plane; and
a solder element placed over the at least one cone-shaped protrusion of the molded body.
2. The semiconductor device according to claim 1 , further comprising a first layer over the semiconductor chip and the molded body that electrically connects the semiconductor chip with the solder element.
3. The semiconductor device according to claim 1 , wherein the molded body includes a plurality of cone-shaped protrusions, each of the plurality of cone-shaped protrusions including a solder element placed there over.
4. The semiconductor device according to claim 1 , wherein the coplanar plane is interrupted by the at least one cone-shaped protrusion.
5. The semiconductor device according to claim 1 , wherein the coplanar plane is solely interrupted by the at least one cone-shaped protrusion.
6. The semiconductor device of claim 1 wherein the solder element covers the entire at least one cone-shaped protrusion.
7. A semiconductor device comprising:
a semiconductor chip having a first main face and an opposite second face, a connection element formed on the first main face;
a molded body covering the semiconductor chip but not covering the first main face, the molded body having a mold surface substantially coplanar with the first main face of the semiconductor chip, the molded body including at least one protrusion extending from the mold surface;
a solder element placed over the at least one protrusion; and
a redistribution layer formed on the first main face of the semiconductor chip and on the mold surface wherein the redistribution layer electrically connects the solder element and the connection element.
8. The semiconductor device of claim 7 wherein the molded body includes a plurality of protrusions, each of the plurality of protrusions including a solder element placed thereover.
9. The semiconductor device of claim 7 wherein the mold surface is interrupted by the at least one protrusion.