IP Library Granted Patent US 9,623,450
Granted Patent B2
US 9,623,450 · App. 13/756,959 · Granted Apr 18, 2017

Substrate cleaning apparatus for cleaning a lower surface of a substrate

Inventor: Koji Nishiyama (Kyoto, JP)
Assignee: SCREEN Semiconductor Solutions Co., Ltd.
B08B3/04H01L21/67046H01L21/67051H01L21/68728
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Quick Facts
Patent No.
US 9,623,450
App. No.
13/756,959
Granted
Apr 18, 2017
Kind
B2
Abstract

A rotating shaft is provided to extend downward from the inside of a spin motor. A plate supporting member is attached to the lower end of the rotating shaft. A spin plate is supported in a horizontal attitude by the plate supporting member. A substrate holding mechanism is provided at the periphery on the spin plate. The lower end of an annular member is formed to be opposite to an annular region extending along the periphery on the upper surface of the substrate held by a spin chuck. A distance between the upper surface of the substrate and the lower surface of the spin plate is larger than a distance between the upper surface of the substrate and the lower end of the annular member.

Claims (46)

1. A substrate cleaning apparatus that cleans a lower surface of a substrate, comprising:

a rotating member that is provided to be rotatable around a rotation axis extending in a vertical direction;

a rotation-driving device that rotates said rotating member;

a plurality of holding members located at a periphery of the rotating member are configured to be rotatable together with said rotating member and hold the substrate by abutting against an outer peripheral edge of the substrate at a position below said rotating member;

a shield member that is provided at said rotating member so as to cover a space above an upper surface of the substrate held by said holding members and has an opening at a position in which said rotation axis is included;

a fluid supply pipe that supplies a fluid through said opening to the upper surface of the substrate held by said holding members; and

a cleaning mechanism that cleans the lower surface of the substrate held by said holding members; wherein

said shield member has

an opposite lower surface that is opposite to the upper surface of the substrate held by said holding members around said opening, and

an annular lowermost end that is formed around said opposite lower surface so as to be opposite to an annular region extending along a periphery in the upper surface of the substrate held by said holding members, and

a distance between the upper surface of the substrate held by said holding members and said opposite lower surface is larger than a distance between the upper surface of the substrate held by said holding members and said lowermost end of said shield member,

the fluid supply pipe has a lower end having a discharge port that discharges the fluid, a distance between the upper surface of the substrate held by the holding members and the lower end of the fluid supply pipe is larger than the distance between the upper surface of the substrate held by the holding members and the lowermost end of the shield member,

the lowermost end of the shield member is positioned above the upper surface of the substrate held by the holding members, and

a gap is formed between the lowermost end of the shield member and the upper surface of the substrate held by the holding members.

2. The substrate cleaning apparatus according to claim 1 , wherein

said shield member includes

a first member that is provided at said rotating member and has said opposite lower surface and said opening, and

an annular second member that has said lowermost end of said shield member, wherein

said second member is provided at said first member such that said lowermost end of said shield member is positioned under said first member, and

said holding members are provided at said first member.

3. The substrate cleaning apparatus according to claim 2 , wherein

said second member further has an upper end that is attached to said first member, and

an inner peripheral surface of said second member is inclined such that an inner diameter of said second member gradually increases from said upper end towards said lowermost end of said shield member.

4. The substrate cleaning apparatus according to claim 1 , further comprising a supporting member that is attached to said rotating member to support said holding members, wherein

said shield member includes

a third member that is provided under said supporting member and has said opposite lower surface and said opening, and

an annular fourth member that has said lowermost end of said shield member, and

said fourth member is provided at said third member such that said lowermost end of said shield member is positioned under said third member.

5. The substrate cleaning apparatus according to claim 4 , wherein

said fourth member further has an upper end attached to said third member, and

an inner peripheral surface of said fourth member is inclined such that an inner diameter of said fourth member gradually increases from said upper end towards said lowermost end of said shield member.

6. The substrate cleaning apparatus according to claim 1 , wherein

said cleaning mechanism includes a brush that cleans the lower surface of the substrate held by said holding members,

a projection abuttable against the lower surface of the substrate is formed on said brush, and

a horizontal cross sectional area of said projection reduces gradually towards an upper end of the brush.

7. The substrate cleaning apparatus according to claim 1 , wherein said cleaning mechanism includes a cleaning liquid discharge nozzle that discharges cleaning liquid from below towards the lower surface of the substrate held by said holding members,

the substrate cleaning apparatus further comprising:

a cleaning mechanism moving device that moves said cleaning mechanism between a position that is opposite to the lower surface of the substrate and a predetermined waiting position that is not opposite to the lower surface of the substrate, and

a liquid receiving member that is provided over said waiting position and configured to receive the cleaning liquid discharged from said cleaning liquid discharge nozzle of said cleaning mechanism when said cleaning mechanism is at said waiting position.

8. A substrate processing apparatus that is arranged adjacent to an exposure device and performs processing on a substrate, comprising:

a processing section for performing the processing on the substrate; and

an interface section for receiving and transferring the substrate between said processing section and said exposure device, wherein

at least one of said processing section and said interface section includes the substrate cleaning apparatus according to claim 1 that cleans the lower surface of the substrate.

9. The substrate cleaning apparatus according to claim 8 , wherein

said processing section includes a photosensitive film formation unit configured to form a photosensitive film made of a photosensitive material on an upper surface of the substrate, and

said substrate cleaning apparatus is configured to clean the lower surface of the substrate after the formation of the photosensitive film by said photosensitive film formation unit and before or after the exposure processing by said exposure device.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 29, 2014
From: SOKUDO CO., LTD.
To: SCREEN SEMICONDUCTOR SOLUTIONS CO., LTD.
Reel/Frame 033845/0470 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 1, 2013
From: NISHIYAMA, KOJI
To: SOKUDO CO., LTD.
Reel/Frame 029740/0679 →
Priority Claims (1)
JP 2012-072456 · Mar 27, 2012 · national
Continuity (1)
Related Publication 20130258300A1 · Oct 3, 2013