Power supply with low electro-magnetic interference and inductor for power supply with low electro-magnetic interference

1. A power supply circuit comprising:

a boost inductor configured to receive a rectified input signal;

a diode coupled to the boost inductor;

a bulk capacitor coupled to the diode, wherein the diode is configured to couple energy from the boost inductor to the bulk capacitor; and

a switch coupled to the boost inductor;

wherein the boost inductor has a parasitic capacitance less than about 100 pF; and

wherein the boost inductor comprises a core having a first end and a second end, a wire coil wrapped around the core in a plurality of layers, and an insulation layer between first and second layers of the wire coil, and

wherein the insulation layer comprises at least one layer of an insulating material having a relative permittivity greater than one that extends around the first layer of the wire coil and extends from a first end of the core to a second end of the core.

2. The power supply circuit of claim 1 , wherein the diode comprises a Schottky diode.

3. The power supply circuit of claim 1 further comprising a controller coupled to the switch and configured to control a state of the switch, wherein the controller is configured to operate the power supply circuit in a continuous conduction mode.

4. The power supply circuit of claim 1 , wherein the insulating material comprises a layer of insulation tape.

5. The power supply circuit of claim 4 , wherein the insulation layer comprises at least two layers of insulation tape.

6. The power supply circuit of claim 1 , wherein the insulation layer has a thickness of at least about 1 mil.

7. The power supply circuit of claim 1 , wherein the insulation layer comprises a material having a relative permittivity of about 1 to about 5.

8. The power supply circuit of claim 1 , wherein the layers of the coil are wound in a “C” winding configuration.

9. The power supply circuit of claim 1 , wherein the layers of the coil are wound in a “Z” winding configuration.

10. The power supply circuit of claim 1 , wherein the inductor further comprises insulation layers between each pair of adjacent layers of the wire coil.

11. The power supply circuit of claim 1 , wherein the inductor further comprises a plurality of layers of insulation tape between each pair of adjacent layers of the wire coil.

12. The power supply circuit of claim 1 , wherein the insulation layer comprises a material having a relative permittivity of less than 3.

13. The power supply, circuit of claim 1 , wherein the wire coil comprises at least three layers, and wherein the inductor further comprises insulation layers between each pair of adjacent layers of the wire coil.

14. A power supply circuit comprising:

an input configured to receive an input voltage;

an output configured to supply an output voltage;

at least one inductor;

at least one diode; and

at least one switch;

wherein the at least one inductor has a parasitic capacitance less than about 100 pF; and

wherein the boost inductor comprises a core, a wire wrapped around the core in a plurality of layers, and an insulation layer between first and second layers of the wire coil, and

wherein the insulation layer comprises at least one layer of an insulating material having relative permittivity greater than one that extends around the first layer of the wire coil.

15. The power supply circuit of claim 14 , wherein the power supply circuit comprises one of a boost converter, a buck converter, a split-pi converter, a Cuk converter, a single-ended primary-inductor converter, and a buck-boost converter.