LED lighting assemblies with thermal overmolding
View Patent ↗One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.
1. A lighting assembly comprising:
a printed circuit board;
one or more light emitting diodes (LEDs) disposed on the printed circuit board and connectable with a power source via circuitry of the printed circuit board;
the LEDs comprising a semiconductor chip disposed on a base;
an overmolded housing material molded over the printed circuit board such that the printed circuit board is embedded in the housing material, the material having a melting temperature greater than about 100° C.; and
said overmolded housing material terminating at a height between said printed circuit board and said LED such that said base and said semiconductor chip protrude from the overmolded housing.
2. The lighting assembly as set forth in claim 1 , wherein a phosphor coats the one or more LEDs.
3. The lighting assembly as set forth in claim 1 , further comprising:
a light-transmissive cover disposed over one or more of the one or more LEDs and wherein the light-transmissive cover includes a phosphor.
4. The lighting assembly as set forth in claim 1 , wherein the housing material does not encapsulate the one or more LEDs disposed on the printed circuit board.
5. The lighting assembly as set forth in claim 1 , wherein the housing material does not cover light-emitting apertures of the one or more LEDs.
6. The lighting assembly as set forth in claim 1 , wherein the lighting assembly does not include a container or housing other than the overmolded housing.
7. The lighting assembly as set forth in claim 1 , further comprising:
a light-transmissive cover disposed over one or more of the one or more LEDs, the housing material encapsulating the printed circuit board but not covering at least a portion of the light-transmissive cover.
8. The lighting assembly as set forth in claim 7 , wherein the light-transmissive cover includes a base region disposed on the printed circuit board and wherein the housing material contacts the base region without fully covering the one or more light-transmissive covers.
9. The lighting assembly as set forth in claim 1 , wherein the housing material has a melting temperature between about 310° C. and about 500° C.
10. The lighting assembly as set forth in claim 1 , wherein the housing material has a melting temperature between about 310° C. and about 350° C.
11. The lighting assembly as set forth in claim 1 , wherein the housing material has a thermal conductivity greater than 1 W/m·K.
12. The lighting assembly of claim 1 , further comprising a plurality of flexible electrical conductors including insulation surrounding the conductors, the conductors being electrically and mechanically connected to the printed circuit board.
13. The lighting assembly of claim 1 wherein said overmolded housing material abuts the base of the LEDs.