IP Library Granted Patent US 10,119,696
Granted Patent B2
US 10,119,696 · App. 13/764,885 · Granted Nov 6, 2018

Amplification circuit and heat sink used with a light emitting apparatus having varying voltages

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Quick Facts
Patent No.
US 10,119,696
App. No.
13/764,885
Granted
Nov 6, 2018
Kind
B2
Abstract

A light emitting apparatus having a housing including a portion defining a thermally conductive outer surface, a light source positioned within the housing, and an internal heat sink thermally coupling the light source and the thermally conductive outer surface portion of the housing. The light source may be a solid state device, such as a light emitting diode.

Claims (13)

1. A light emitting apparatus comprising:

a housing including a portion defining a thermally conductive outer surface;

a high power LED light source positioned within the housing, wherein photometric output of the high power LED increases proportionately with supplied current, and wherein the high power LED is electrically coupled to a voltage source, and a pulse width modulation controller for controlling a duty cycle of supplied input voltage;

a lens housed by the housing and aligned with the light source; and

an internal heat sink located to thermally couple with the high power LED light source and conduct heat away from the light source, independent of another conducting medium, and transfer the conducted heat to the thermally conductive outer surface portion of the housing, upon being connected to the thermally conductive outer surface;

wherein a junction temperature of the high power LED is maintained and controlled through the thermal coupling of the high power LED light source, the internal heat sink and the conductive outer surface portion of the housing.

2. The light emitting apparatus according to claim 1 , wherein the housing includes a plurality of components.

3. The light emitting apparatus according to claim 2 , wherein at least one component of the housing includes at least a portion of the internal heat sink.

4. The light emitting apparatus according to claim 1 , wherein at least a portion of the housing comprises a thermally conductive material.

5. The light emitting apparatus according to claim 1 , wherein at least a portion of the housing is metallic.

6. The light emitting apparatus according to claim 1 , wherein the portion of the housing includes a finished aluminum surface.

7. The light emitting apparatus according to claim 1 , wherein the light source is a solid state device.

8. The light emitting apparatus according to claim 1 , wherein the light source is mounted on the heat sink.

Assignments (4)
RELEASE OF PATENT SECURITY INTEREST Recorded May 14, 2024
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: HASKEL INTERNATIONAL, LLC; MILTON ROY, LLC; INGERSOLL-RAND INDUSTRIAL U.S., INC.
Reel/Frame 067401/0811 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 5, 2021
From: MADINENI, VIKRAM; BARTOSZEK, JASON
To: INGERSOLL-RAND COMPANY
Reel/Frame 056136/0869 →
SECURITY INTEREST Recorded Mar 3, 2020
From: CLUB CAR, LLC; MILTON ROY, LLC; HASKEL INTERNATIONAL, LLC; INGERSOLL-RAND INDUSTRIAL U.S., INC.
To: CITIBANK, N.A., AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT
Reel/Frame 052072/0381 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 16, 2019
From: INGERSOLL-RAND COMPANY
To: INGERSOLL-RAND INDUSTRIAL U.S., INC.
Reel/Frame 051316/0478 →