Method of manufacturing an integrated cold plate for electronics

1. A method of manufacturing a cold plate comprising:

a. obtaining a base plate with a top surface, a bottom surface, and an edge;

b. machining an inlet trough and an outlet trough in the top surface of the base plate;

c. cutting fins into the base plate with a tool, where the tool contacts the base plate in one of the inlet trough and the outlet trough and where the tool exits the base plate in the other of the inlet trough and the outlet trough;

d. machining a base plate inlet nozzle indent from the inlet trough to the edge of the base plate;

e. machining a base plate outlet nozzle indent from the outlet trough to the edge of the base plate;

f. providing a cover with a cover inlet nozzle indent and a cover outlet nozzle indent;

g. aligning the cover with the base plate such that the cover inlet nozzle indent is positioned over the base plate inlet nozzle indent and the cover outlet nozzle indent is positioned over the base plate outlet nozzle indent;

h. securing the cover to the base plate over the enhancements such that the enhancements are positioned within an enclosure formed by the base plate and the cover;

g. securing an inlet nozzle in the base plate inlet nozzle indent and the cover inlet nozzle indent; and

i. securing an outlet nozzle in the base plate outlet nozzle indent and the cover outlet nozzle indent.

2. The method of claim 1 further comprising connecting an electronic component to the base plate with solder.

3. The method of claim 2 where the electronic component comprises an insulated gate by-polar transistor (IGBT) electronic component, the method further comprising:

j. placing the cold plate in an IGBT housing such that the inlet nozzle and outlet nozzle extend out of the IGBT housing; and

k. sealing the IGBT housing with the cold plate inside.

4. The method of claim 2 further comprising:

l. connecting a plurality of cold plates together with a plurality of inlet and outlet nozzles;

m. placing the plurality of cold plates in an IGBT housing; and

n. sealing the IGBT housing with the plurality of cold plates inside.

5. The method of claim 2 further comprising passing liquid at a temperature above a solder melting point through the base plate until the solder melts.

6. The method of claim 1 where the fins further comprise an enhancement top, and the fins are cut such that the enhancement top rises higher than the top surface.

7. The method of claim 1 where the tool comprises a cutting edge, and only a single point of the cutting edge initially contacts the base plate when making a cut.