IP Library Granted Patent US 9,060,453
Granted Patent B2
US 9,060,453 · App. 13/771,452 · Granted Jun 16, 2015

Frame having attachment arms, a latching mechanism and handling levers

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Quick Facts
Patent No.
US 9,060,453
App. No.
13/771,452
Granted
Jun 16, 2015
Kind
B2
Abstract

An electronic component carrier and method for mounting the electronic component to a circuit board includes a frame including a header having opposing attachment arms extending outwardly therefrom for seating an electronic component within the frame. A latching mechanism of the frame includes latching members at a distal end of each of the attachment arms for releasably seating the electronic component between the attachment members. The attachment members are resiliently flexible such that the latching members bend to a release position and resiliently return to a grasping position. Handling levers extend upwardly from the header through an outer casing housing the circuit board when in an open position for manually removing the electronic component from the connector, and the handling levers are substantially parallel with a top surface of the header when in a closed position when the electronic component is mated to the connector.

Claims (38)

1. An apparatus for holding an electronic component for mounting on a circuit board, comprising:

a frame including a header having opposing attachment arms extending therefrom, each of the attachment arms including an inwardly facing groove for seating an electronic component between the opposing inwardly facing grooves, and each of the attachment arms further including a second groove extending down a length of the attachment arm from a proximal end of the attachment arm to the inwardly facing groove of the attachment arm such that the second grooves are aligned between the attachment arms;

a latching mechanism of the frame including latching members at a distal end of each of the attachment arms for releasably seating the electronic component between the attachment arms;

a moveable locking device positioned within the second grooves of the attachment is such that the moveable locking device is slideably positioned between the attachment arms and above the electronic component; and

handling levers for removably mating the electronic component to a connector on a circuit board, the handling levers extending upwardly from the header through an outer casing housing the circuit board.

2. The apparatus of claim 1 , wherein the attachment arms are resiliently flexible such that the latching members bend to a release position and resiliently return to a grasping position for releasing and grasping the electronic component, respectively.

3. The apparatus of claim 2 , wherein the latching members include locking elements positioned at distal ends of the latching members for mating with receiving elements of the electronic component.

4. The apparatus of claim 1 , wherein the handling levers are in an open position when the handling levers extend upwardly for manually removing the electronic component from the connector on the circuit board, and the handling levers are in a closed position when substantially parallel with a top surface of the header when the electronic component is mated to connector on the circuit board.

5. The apparatus of claim 4 , wherein the handling levers are rotatably attached to the header of the frame.

6. The apparatus of claim 4 , wherein the handling levers each include an extension element extending from a distal end of the handling lever and passing through a mating pair of openings defined by the header and a housing for the extension element, the housing configured to receive the frame within the housing, the extension elements extending angularly through their respective openings when the handling levers are in the open position such that the apparatus can be removed from the outer casing, and the extension elements abutting a top of each of the openings when the handling levers are in the closed position such that the apparatus is locked in the housing and the electronic component is seated in the connector.

7. The apparatus of claim 1 , further comprising:

a release mechanism on the header for actuating the handling levers into the open position when the handling levers are in the closed position.

8. The apparatus of claim 1 , wherein the electronic component is a Dual In-line Memory Module (DIMM).

9. The apparatus of claim 1 , further comprising:

wherein the attachment arms are attachable to a heat transfer member therebetween being positioned above the electronic component and seated within the frame.

10. The apparatus of claim 1 ,

wherein the moveable locking device engages a top of the electronic component when locking the electronic component between the attachment arms.

11. An electronic component carrier for mounting the electronic component to a circuit board, comprising:

a frame including a header having opposing attachment arms extending outwardly therefrom for seating an electronic component within the frame;

a latching mechanism of the frame including latching members at a distal end of each of the attachment arms for releasably seating the electronic component between the attachment arms, the attachment arms being resiliently flexible such that the latching members bend to a release position and resiliently return to a grasping position for releasing and grasping the electronic component, respectively; and

handling levers for removably mating the electronic component to a connector on a circuit board, the handling levers extending upwardly from the header through an outer casing housing the circuit board when in an open position for manually removing the electronic component from the connector, and the handling levers being substantially parallel with a top surface of the header when in a closed position when the electronic component is mated to the connector.

12. The carrier of claim 11 , further comprising:

a release mechanism on the header for actuating the handling levers into the open position when the handling levers are in the closed position.

13. The carrier of claim 11 , wherein the electronic component is a Dual In-line Memory Module (DIMM).

14. The carrier of claim 11 , further comprising:

a moveable locking device positioned between the attachment arms and slidable engaging a top of the electronic component for locking the electronic component between the attachment arms.

15. The carrier of claim 11 , wherein the latching members include locking elements positioned at distal ends of the latching members for mating with receiving elements of the electronic component.

16. The carrier of claim 11 , wherein the attachment arms are attachable to a heat transfer member therebetween being positioned above the electronic component and seated within the frame.

17. The carrier of claim 11 , wherein the handling levers each include an extension element extending from of the handling lever and passing through a mating pair of openings defined by the header and a housing for the extension element, the housing configured to receive the frame within the housing, the extension elements extending angularly through their respective openings when the handling levers are in the open position such that the carrier can be removed from the outer casing, and the extension elements abutting a top of each of the openings when the handling levers are in the closed position such that the carrier is locked in the housing and the electronic component is seated in the connector.

18. An electronic component holding system for mounting the electronic component to a circuit board, comprising:

a frame including a header having opposing attachment arms extending outward therefrom for seating an electronic component within the frame;

a latching mechanism of the frame including latching members at a distal end of each of the attachment arms for releasably seating the electronic component between the attachment arms, the attachment arms being resiliently flexible such that the latching members bend to a release position and resiliently return to a grasping position for releasing and grasping the electronic component, respectively;

handling levers for removably mating the electronic component to a connector on a circuit board, the handling levers extending upwardly from the header through an outer casing housing the circuit board when in an open position for manually removing the electronic component from the connector, and the handling levers being substantially parallel with atop surface of the header when in a closed position when the electronic component is mated to the connector; and

a housing configured to receive the frame within the housing and operatively engage an extension element extending from a end of each of the handling levers and passing through a mating pair of openings defined by the header and the housing for each of the extension elements, the extension elements extending angularly through their respective openings when the handling levers are in the open position such that the frame can be removed from the outer casing, and the extension elements abutting a top of each of the openings when the handling levers are in the closed position such that the frame is locked in the housing and the electronic component is seated in the connector.

19. The system of claim 18 , further comprising:

a moveable locking device positioned between the attachment arms and slidable engaging a top of the electronic component for locking the electronic component between the attachment arms.

20. The system of claim 18 , wherein the attachment arms are attachable to a heat transfer member therebetween being positioned above the electronic component and seated within the frame.

21. The system of claim 18 , wherein multiple frames are received within the housing.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 6, 2019
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE LTD.
To: LENOVO INTERNATIONAL LIMITED
Reel/Frame 050304/0277 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNMENT DOCUMENT CONTAINING TYPO ERRORS PREVIOUSLY RECORDED AT REEL: 037101 FRAME: 0969. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Dec 28, 2015
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
To: LENOVO INTERNATIONAL LIMITED
Reel/Frame 037689/0190 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 12, 2015
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
To: LENOVO INTERNATIONAL LIMITED
Reel/Frame 037101/0969 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2014
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
Reel/Frame 034194/0353 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 20, 2013
From: COX, AARON R.; FU, ZHEN DE; SAYLOR, JONI E.; LI, LEI R.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 029839/0019 →