Semiconductor module
A semiconductor module includes a semiconductor element, a case member, a cylindrical body, a lid member, a bus bar, and an insulating plate. The case member includes a bottom member and an extended portion. Eight protruding portions are formed on an outer peripheral surface of the cylindrical body. Eight recessed portions are formed on an inner surface of a central hole of the bus bar. The cylindrical body is inserted into the central hole of the bus bar. The protruding portions of the cylindrical body are engaged with the recessed portions of the bus bar. A direction in which an extended portion of the bus bar extends is fixed in one direction, from among a plurality of directions in a circumferential direction of the cylindrical body, by engagement of the protruding portions with the recessed portions.
1. A semiconductor module comprising:
a first semiconductor element that has a first front surface electrode on a front surface and has a first back surface electrode on a back surface;
a first bottom member that is contacting the first back surface electrode;
a first cylindrical body that is formed by an insulating body, is formed in a cylindrical shape, surrounds the first semiconductor element, is fixed to the first bottom member, and in which a first screw groove is formed on an outer peripheral surface or an inner peripheral surface;
a lid member that is formed by an electric conductor, is contacting the first front surface electrode, and has a second screw groove that engages with the first screw groove;
a first conducting member that is formed by an electric conductor, has a first through-hole into which the first cylindrical body is inserted and a first extended portion that extends outward from an outer peripheral surface of the first cylindrical body, is provided outside of the first cylindrical body, and is contacting the lid member;
a second conducting member that is formed by an electric conductor, is provided outside of the first cylindrical body, and is contacting the first bottom member; and
a first insulating member that insulates between the first conducting member and the second conducting member,
wherein the lid member is fixed to the first cylindrical body by engagement of the second screw groove with the first screw groove; the first conducting member is fixed with respect to the lid member and the first bottom member, by being sandwiched between the lid member and the first bottom member that are fixed to the first cylindrical body; the first semiconductor element is fixed with respect to the lid member and the first bottom member, by being sandwiched between the lid member and the first bottom member; a first protruding portion is formed on one of the outer peripheral surface of the first cylindrical body and an inner surface of the first through-hole, a first recessed portion that is able to engage with the first protruding portion is formed on the other of the outer peripheral surface of the first cylindrical body and the inner surface of the first through-hole, and when the first cylindrical body is inserted into the first through-hole, the first protruding portion and the first recessed portion engage, such that the first conducting member is positioned with respect to the first cylindrical body; a plurality of positioning positions of the first conducting member with respect to the first cylindrical body are provided in a circumferential direction by the first protruding portion being formed in at least one location in the circumferential direction, and the first recessed portion being formed in a plurality of locations in the circumferential direction; and the first extended portion extends in one direction, for among a plurality of directions in the circumferential direction of the first cylindrical body, corresponding to the plurality of positioning positions of the first conducting member.
2. The semiconductor module according to claim 1 , wherein the second conducting member has a second through-hole into which the first cylindrical body is inserted, and a second extended portion that extends outward from the outer peripheral surface of the first cylindrical body; a second protruding portion is formed on one of the outer peripheral surface of the first cylindrical body and an inner surface of the second through-hole, and a second recessed portion that is able to engage with the second protruding portion is formed on the other of the outer peripheral surface of the first cylindrical body and the inner surface of the second through-hole; when the first cylindrical body is inserted into the second through-hole, the second protruding portion and the second recessed portion engage, such that the second conducting member is positioned with respect to the first cylindrical body; a plurality of positioning positions of the second conducting member with respect to the first cylindrical body are provided in a circumferential direction by the second protruding portion being formed in at least one location in the circumferential direction, and the second recessed portion being formed in a plurality of locations in the circumferential direction; and the second extended portion extends in one direction, for among a plurality of directions in the circumferential direction of the first cylindrical body, corresponding to the plurality of positioning positions of the second conducting member.
3. The semiconductor module according to claim 1 , further comprising:
a second semiconductor element that has a second front surface electrode on a front surface and has a second back surface electrode on a back surface;
a second bottom member that is contacting the second back surface electrode;
a second cylindrical body that is formed by an insulating body, surrounds the second semiconductor element, and is fixed to one of the second bottom member and the first bottom member;
a third conducting member that is formed by an electric conductor, is provided outside of the second cylindrical body, and is contacting the second bottom member; and
a second insulating member that insulates between the third conducting member and the first bottom member,
wherein the second front surface electrode is contacting a surface of the first bottom member, which is on a side opposite a surface that is contacting the first back surface electrode; the third conducting member is fixed with respect to the first bottom member and the second bottom member, by being sandwiched between the first bottom member and the second bottom member; and the second semiconductor element is fixed with respect to the first bottom member and the second bottom member, by being sandwiched between the first bottom member and the second bottom member.
4. The semiconductor module according to claim 1 , wherein the second conducting member is fixed with respect to the lid member and the first bottom member, by being sandwiched between the lid member and the first bottom member that are fixed to the first cylindrical body.