Method and apparatus for load-locked printing
View Patent ↗The disclosure relates to a method and apparatus for preventing oxidation or contamination during a circuit printing operation. The circuit printing operation can be directed to OLED-type printing. In an exemplary embodiment, the printing process is conducted at a load-locked printer housing having one or more of chambers. Each chamber is partitioned from the other chambers by physical gates or fluidic curtains. A controller coordinates transportation of a substrate through the system and purges the system by timely opening appropriate gates. The controller may also control the printing operation by energizing the print-head at a time when the substrate is positioned substantially thereunder.
1. A method for forming a film of a selected material on a substrate, comprising:
receiving a substrate at a substrate-inlet region;
transporting the substrate to a substrate-printing region;
providing an inert-gas environment at the substrate-printing region, wherein the printing region comprises a print-head chamber enclosing at least one print-head having at least one nozzle;
floating the substrate at the substrate-printing region, wherein said substrate is floated with a combination of pressure and vacuum;
while floating the substrate, printing a film of a selected material on the substrate with the at least one print-head having at least one nozzle;
transporting the substrate away from the substrate-printing region; and,
removing the substrate from a substrate-outlet region.
2. The method of claim 1 , further comprising after the step of receiving a substrate at a substrate-inlet region:
isolating the substrate-inlet region; and,
providing the substrate-inlet region with an inert-gas environment.
3. The method of claim 1 , further comprising after the step of transporting the substrate to a substrate-printing region:
isolating the substrate-printing region.
4. The method of claim 1 , wherein said inert-gas environment comprises a nitrogen-gas environment.
5. The method of claim 1 , wherein said printing step forms a patterned film.
6. The method of claim 1 , wherein said material is an organic material.
7. The method of claim 1 , wherein said substrate inlet-region is adjacent said substrate-printing region.
8. The method of claim 1 , wherein said substrate-printing region is adjacent said substrate-outlet region.
9. The method of claim 1 , wherein said substrate-printing region is between said substrate-inlet region and said substrate-outlet region.
10. The method of claim 1 , further comprising:
an intermediate processing step at an intermediate substrate-processing region between said substrate-inlet region and said substrate-outlet region.
11. The method of claim 10 , wherein after the step of receiving a substrate at a substrate-inlet region and before the step of printing a film of a selected material on the substrate said intermediate processing step comprises a substrate alignment step.
12. The method of claim 5 , wherein the patterned film is printed on a substrate for an OLED display.
13. The method of claim 6 , wherein the organic material comprises an OLED material.
14. The method of claim 1 , wherein the print-head comprises an ink chamber in flow communication with a nozzle.
15. The method of claim 1 , wherein the substrate is floated with a combination of pressure and vacuum using a gas bearing comprising a plurality of gas ports and vacuum ports.
16. The method of claim 15 , wherein a floatation gas used for the plurality of gas ports is an inert gas.
17. The method of claim 16 , wherein the inert gas is nitrogen.
18. The method of claim 1 , further comprising after the step of transporting the substrate away from the substrate-printing region:
moving the substrate to a substrate-outlet region; and
isolating the substrate-printing region from the substrate-outlet region.