IP Library Patent Application 13773661
Patent Application
App. No. 13/773,661

HEAT DISSIPATING DEVICE AND METHOD OF MANUFACTURING THE SAME

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Quick Facts
Patent No.
US None
App. No.
13/773,661
Abstract

A method of manufacturing a heat dissipating device includes steps of providing a base, wherein the base includes a clamping portion, a supporting portion and two side portions, the clamping portion is arc-shaped, a first recess structure is formed on an outer surface toward an inner surface of each side portion, the two side portions connect the clamping portion and the supporting portion, and an accommodating space is formed between the clamping portion, the supporting portion and the two side portions; disposing a first end of a heat pipe in the accommodating space, wherein the first end is supported on the supporting portion; and punching the clamping portion toward the supporting portion such that the clamping portion cooperates with the supporting portion to clamp the first end in a tight-fitting manner, wherein the clamping portion is capable of deforming through the first recess structure during punch processing.

Claims (25)

1 . A heat dissipating device comprising:

a base comprising a clamping portion, a supporting portion and two side portions, a first recess structure being formed on an outer surface toward an inner surface of each side portion, the clamping portion being opposite to the supporting portion, the two side portions connecting the clamping portion and the supporting portion, an accommodating space being formed between the clamping portion, the supporting portion and the two side portions; and

a heat pipe, a first end of the heat pipe being disposed in the accommodating space and supported on the supporting portion, the clamping portion cooperating with the supporting portion to clamp the first end of the heat pipe in a tight-fitting manner.

2 . The heat dissipating device of claim 1 , wherein the outer surface of each side portion is S-shaped or Z-shaped.

3 . The heat dissipating device of claim 1 , wherein a second recess structure is formed on the inner surface toward the outer surface of each side portion.

4 . The heat dissipating device of claim 1 , wherein an opening is formed on the supporting portion such that a bottom surface of the first end is exposed out of the opening, and a width of the opening is smaller than a maximum width of the first end.

5 . The heat dissipating device of claim 4 , wherein the bottom surface of the first end and a bottom surface of the base are coplanar.

6 . The heat dissipating device of claim 1 , further comprising a heat sink disposed on a second end of the heat pipe.

7 . The heat dissipating device of claim 1 , further comprising two fixing members disposed on the base, wherein the accommodating space is located between the two fixing members.

8 . The heat dissipating device of claim 1 , wherein the heat pipe is a flat heat pipe.

9 . A method of manufacturing a heat dissipating device comprising:

providing a base, wherein the base comprises a clamping portion, a supporting portion and two side portions, the clamping portion is arc-shaped, a first recess structure is formed on an outer surface toward an inner surface of each side portion, the clamping portion is opposite to the supporting portion, the two side portions connect the clamping portion and the supporting portion, and an accommodating space is formed between the clamping portion, the supporting portion and the two side portions;

disposing a first end of a heat pipe in the accommodating space, wherein the first end is supported on the supporting portion; and

punching the clamping portion toward the supporting portion such that the clamping portion cooperates with the supporting portion to clamp the first end of the heat pipe in a tight-fitting manner, wherein the clamping portion is capable of deforming through the first recess structure during punch processing.

10 . The method of claim 9 , wherein the outer surface of each side portion is S-shaped or Z-shaped.

11 . The method of claim 9 , wherein a second recess structure is formed on the inner surface toward the outer surface of each side portion such that the clamping portion is capable of deforming through the second recess structure during punch processing.

12 . The method of claim 9 , wherein an opening is formed on the supporting portion such that a bottom surface of the first end is exposed out of the opening, and a width of the opening is smaller than a maximum width of the first end.

13 . The method of claim 12 , wherein the bottom surface of the first end and a bottom surface of the base are coplanar.

14 . The method of claim 9 , further comprising:

forming the base by an aluminum extrusion process.

15 . The method of claim 9 , further comprising:

disposing a heat sink on a second end of the heat pipe.

16 . The method of claim 9 , further comprising:

disposing two fixing members on the base, wherein the accommodating space is located between the two fixing members.

17 . The method of claim 9 , wherein the heat pipe is a flat heat pipe.

Assignments (2)
CHANGE OF NAME Recorded Jan 18, 2014
From: COOLER MASTER CO., LTD.
To: COOLER MASTER DEVELOPMENT CORPORATION
Reel/Frame 032088/0149 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2013
From: HSIEH, TSUNG-HSIEN; LIU, YU-CHIN
To: COOLER MASTER CO., LTD.
Reel/Frame 029854/0769 →