IP Library Granted Patent US 8,768,114
Granted Patent B2
US 8,768,114 · App. 13/775,445 · Granted Jul 1, 2014

Opto-electric hybrid board and method of manufacturing same

Inventors: Yuichi Tsujita (Ibaraki, JP); Yasuto Ishimura (Ibaraki, JP); Hiroyuki Hanazono (Ibaraki, JP); Naoyuki Tanaka (Ibaraki, JP); Yasufumi Yamamoto (Ibaraki, JP); Shotaro Masuda (Ibaraki, JP); Mayu Ozaki (Ibaraki, JP)
Assignee: Nitto Denko Corporation
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Quick Facts
Patent No.
US 8,768,114
App. No.
13/775,445
Granted
Jul 1, 2014
Kind
B2
Abstract

An opto-electric hybrid board which is capable of suppressing the increase in light propagation losses and which is excellent in flexibility, and a method of manufacturing the same are provided. The opto-electric hybrid board includes an electric circuit board, an optical waveguide, and a metal layer. The electric circuit board includes an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer. The optical waveguide is formed on the back surface of the insulative layer of the electric circuit board. The metal layer is formed between the optical waveguide and the back surface of the insulative layer of the electric circuit board. The metal layer is patterned to have a plurality of strips. Cores of the optical waveguide are disposed in a position corresponding to a site where the metal layer is removed by the patterning.

Claims (17)

1. An opto-electric hybrid board, comprising:

an electric circuit board including an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer;

an optical waveguide including a cladding layer and cores, the optical waveguide being formed on the back surface of the insulative layer of the electric circuit board; and

a metal layer formed between the cladding layer of the optical waveguide and the back surface of the insulative layer of the electric circuit board,

wherein the metal layer is patterned to have a plurality of strips, and

wherein the cores of the optical waveguide are disposed in a position corresponding to a site where the metal layer is removed by the patterning.

2. The opto-electric hybrid board according to claim 1 ,

wherein part of the opto-electric hybrid board is formed as a to-be-bent portion;

wherein the metal layer is partially removed in a position corresponding to the to-be-bent portion; and

wherein the cladding layer of the optical waveguide fills a site where the metal layer is removed.

3. A method of manufacturing an opto-electric hybrid board, comprising:

forming an insulative layer on a first surface of a metal layer;

forming electrical interconnect lines on a surface of the insulative layer; and

forming an optical waveguide on a second surface of the metal layer,

wherein the metal layer is etched to form a pattern having a plurality of strips prior to the step of forming the optical waveguide, and

wherein cores of the optical waveguide are disposed in a position corresponding to a site where the metal layer is removed by the etching.

4. The method according to claim 3 , wherein a portion of the metal layer corresponding to a to-be-bent portion of the opto-electric hybrid board is removed by etching.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 25, 2013
From: TSUJITA, YUICHI; ISHIMARU, YASUTO; HANAZONO, HIROYUKI; TANAKA, NAOYUKI; YAMAMOTO, YASUFUMI; MASUDA, SHOTARO; OZAKI, MAYU
To: NITTO DENKO CORPORATION
Reel/Frame 029867/0016 →
Priority Claims (1)
JP 2012-060632 · Mar 16, 2012 · national
Continuity (1)
Related Publication 20130243370A1 · Sep 19, 2013