Semiconductor element for a thermoelectric module, method for producing the semiconductor element and thermoelectric module

1. A semiconductor element, comprising:

a thermoelectric material and a first frame part being force-lockingly connected to one another;

said first frame part having two mutually opposite circumferential surfaces spaced apart by a spacing defining a thickness of said first frame part, and one of said circumferential surfaces being an attachment surface facing said thermoelectric material, said first frame part forming a diffusion barrier for said thermoelectric material and an electric conductor.

2. The semiconductor element according to claim 1 , wherein:

said thermoelectric material has two oppositely-disposed element surfaces;

a second frame part is disposed on one of said element surfaces; and

said first frame part is disposed on the other of said element surfaces.

3. A thermoelectric module, comprising:

at least two semiconductor elements according to claim 2 , said semiconductor elements disposed adjacent one another with said first frame parts of adjacent thermoelectric elements in contact with and connected to one another materially at respective contact locations and said second frame parts of adjacent thermoelectric elements in contact with and connected to one another materially at respective contact locations.

4. The thermoelectric module according to claim 3 , wherein said first frame parts of said adjacent semiconductor elements are in contact at respective contact surfaces and are connected to one another materially at said contact surfaces.

5. The thermoelectric module according to claim 3 , wherein at least said first frame parts form a compensation element allowing said semiconductor elements disposed adjacent one another to be moved relative to one another in at least one plane.

6. The thermoelectric module according to claim 3 , wherein at least said first frame parts communicate directly in a thermally conductive manner with a hot medium, or at least said second frame parts communicate in a thermally conductive manner only through an electric insulation with a cold medium.

7. The semiconductor element according to claim 2 , wherein:

said thermoelectric material, said first frame part and said second frame part are annular;

said thermoelectric material has an inner circumferential surface and an outer circumferential surface; and

said first frame part is disposed on said inner circumferential surface and said second frame part is disposed on said outer circumferential surface.

8. The semiconductor element according to claim 1 , wherein said thickness is 0.1 mm to 1 mm.

9. The semiconductor element according to claim 1 , further comprising a coating disposed at least on said attachment surface.

10. The semiconductor element according to claim 9 , wherein said coating includes a solder material.

11. The semiconductor element according to claim 1 , wherein:

said first frame part at least partly has a surface structure on said attachment surface; and

said surface structure includes at least one element selected from the group consisting of:

a groove,

an offset,

a raised portion, and

a roughness of at least 12 μm.

12. The semiconductor element according to claim 1 , wherein at least said first frame part is composed of at least 95% by weight of nickel or molybdenum.

13. A thermoelectric module, comprising:

at least two semiconductor elements according to claim 1 , said semiconductor elements disposed adjacent one another with said first frame parts of adjacent thermoelectric elements in contact with and connected to one another materially at respective contact locations.

14. The thermoelectric module according to claim 13 , wherein said first frame parts of said adjacent semiconductor elements are in contact at respective contact surfaces and are connected to one another materially at said contact surfaces.

15. The thermoelectric module according to claim 13 , wherein at least said first frame parts form a compensation element allowing said semiconductor elements disposed adjacent one another to be moved relative to one another in at least one plane.

16. The thermoelectric module according to claim 13 , wherein at least said first frame parts communicate directly in a thermally conductive manner with a hot medium.

17. A semiconductor element, comprising:

a thermoelectric material and a first frame part being force-lockingly connected to one another;

said first frame part forming a diffusion barrier for said thermoelectric material and an electric conductor,

said first frame part having two mutually opposite contact surfaces spaced apart by a spacing defining a first width;

said thermoelectric material having a second width; and

said first width being at least in part greater than said second width causing said first frame part to project on at least one side of said thermoelectric material.

18. A method for producing a semiconductor element, the method comprising the following steps:

a) providing at least one first frame part having two mutually opposite circumferential surfaces spaced apart by a spacing defining a thickness of said first frame part, and one of said circumferential surfaces being an attachment surface;

b) placing a thermoelectric material on the attachment surface; and

c) compressing at least the first frame part and the thermoelectric material producing a force-locking connection therebetween.

19. The method according to claim 18 , which further comprises providing the thermoelectric material in step b) as a pulverulent or precompressed material.

20. The method according to claim 18 , which further comprises carrying out step c) at a temperature of at least 20° C.

21. A thermoelectric module, comprising:

at least two semiconductor elements produced by the method according to claim 10 , the semiconductor elements disposed adjacent one another with the first frame parts of adjacent thermoelectric elements in contact with and connected to one another materially at respective contact locations.

22. The thermoelectric module according to claim 21 , wherein the first frame parts of the adjacent semiconductor elements are in contact at respective contact surfaces and are connected to one another materially at the contact surfaces.

23. The thermoelectric module according to claim 21 , wherein at least the first frame parts form a compensation element allowing the semiconductor elements disposed adjacent one another to be moved relative to one another in at least one plane.

24. The thermoelectric module according to claim 21 , wherein at least the first frame parts communicate directly in a thermally conductive manner with a hot medium.