IP Library Patent Application 13777156
Patent Application
App. No. 13/777,156

SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD

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Quick Facts
Patent No.
US None
App. No.
13/777,156
Abstract

A substrate treating apparatus for treating substrates by immersing the substrates in a treating solution includes the following elements. A treating tank for storing the treating solution; a lifter capable of supporting a plurality of substrates, and vertically movable between an upper withdrawn position above the treating tank and a treating position inside the treating tank; a treating solution supply device for supplying the treating solution to the treating tank; a dripping device for dripping a surfactant to a surface of the treating solution stored in the treating tank; and a control device for causing the treating solution supply device to supply the treating solution to the treating tank, causing the lifter to place the substrates in the treating position, and causing the dripping device to drip the surfactant when raising the lifter to the upper withdrawn position after treatment of the substrates with the treating solution.

Claims (31)

1 . A substrate treating apparatus for treating substrates by immersing the substrates in a treating solution, comprising:

a treating tank for storing the treating solution;

a lifter capable of supporting a plurality of substrates, and vertically movable between an upper withdrawn position above the treating tank and a treating position inside the treating tank;

a treating solution supply device for supplying the treating solution to the treating tank;

a dripping device for dripping a surfactant to a surface of the treating solution stored in the treating tank; and

a control device for causing the treating solution supply device to supply the treating solution to the treating tank, causing the lifter to place the substrates in the treating position, and causing the dripping device to drip the surfactant when raising the lifter to the upper withdrawn position after treatment of the substrates with the treating solution.

2 . The substrate treating apparatus according to claim 1 wherein the control device is arranged, after beginning to raise the lifter from the treating position, to stop ascent of the lifter and to cause the dripping device to drip the surfactant when upper edges of the substrates are exposed by a predetermined height from the surface of the treating solution.

3 . The substrate treating apparatus according to claim 2 wherein the control device is arranged, after the surfactant is dripped, to lower the lifter to immerse the upper edges of the substrates exposed from the surface of the treating solution, under the surface of the treating solution again, and thereafter to raise the lifter to the upper withdrawn position.

4 . The substrate treating apparatus according to claim 1 wherein the control device is arranged to cause the dripping device to drip the surfactant before the lifter is raised to expose upper edges of the substrates from the surface of the treating solution.

5 . The substrate treating apparatus according to claim 1 wherein the dripping device includes a nozzle body extending in an aligning direction of the substrates supported by the lifter, and located in central parts of the substrates in a direction perpendicular to the aligning direction, and discharge openings formed in a lower surface of the nozzle body for dripping the surfactant between the substrates.

6 . The substrate treating apparatus according to claim 2 wherein the dripping device includes a nozzle body extending in an aligning direction of the substrates supported by the lifter, and located in central parts of the substrates in a direction perpendicular to the aligning direction, and discharge openings formed in a lower surface of the nozzle body for dripping the surfactant between the substrates.

7 . The substrate treating apparatus according to claim 3 wherein the dripping device includes a nozzle body extending in an aligning direction of the substrates supported by the lifter, and located in central parts of the substrates in a direction perpendicular to the aligning direction, and discharge openings formed in a lower surface of the nozzle body for dripping the surfactant between the substrates.

8 . The substrate treating apparatus according to claim 4 wherein the dripping device includes a nozzle body extending in an aligning direction of the substrates supported by the lifter, and located in central parts of the substrates in a direction perpendicular to the aligning direction, and discharge openings formed in a lower surface of the nozzle body for dripping the surfactant between the substrates.

9 . The substrate treating apparatus according to claim 1 wherein the dripping device includes a nozzle body having a discharge opening located centrally of an entire surface of the treating solution stored in the treating tank.

10 . The substrate treating apparatus according to claim 1 further comprising a heating device for heating the treating solution;

wherein the dripping device drips the surfactant having a boiling point lower than a temperature of the treating solution heated by the heating device.

11 . The substrate treating apparatus according to claim 1 wherein the dripping device drips the surfactant consisting of a straight chain alcohol.

12 . A substrate treating method for treating substrates by immersing the substrates in a treating solution, comprising:

a treating step for immersing the substrates in the treating solution by moving a lifter supporting a plurality of substrates from an upper withdrawn position above a treating tank storing the treating solution to a treating position inside the treating tank; and

a dripping step for dripping a surfactant to a surface of the treating solution stored in the treating tank when raising the lifter from the treating position to the upper withdrawn position.

13 . The substrate treating method according to claim 12 wherein the dripping step includes a step of stopping ascent of the lifter when upper edges of the substrates raised with the lifter are exposed by a predetermined height from the surface of the treating solution, and a step of dripping the surfactant in such state.

14 . The substrate treating method according to claim 13 wherein, after the step of dripping the surfactant, the lifter is lowered to immerse the upper edges of the substrates exposed from the surface of the treating solution, under the surface of the treating solution again, and thereafter a raising step is executed to raise the lifter to the upper withdrawn position.

15 . The substrate treating method according to claim 14 wherein the dripping step is executed before the lifter is raised to expose upper edges of the substrates from the surface of the treating solution.

16 . The substrate treating method according to claim 12 wherein the dripping step is executed to drip the surfactant to central parts of the substrates in a direction perpendicular to an aligning direction of the substrates, and between the substrates.

17 . The substrate treating method according to claim 13 wherein the dripping step is executed to drip the surfactant to central parts of the substrates in a direction perpendicular to an aligning direction of the substrates, and between the substrates.

18 . The substrate treating method according to claim 14 wherein the dripping step is executed to drip the surfactant to central parts of the substrates in a direction perpendicular to an aligning direction of the substrates, and between the substrates.

19 . The substrate treating method according to claim 15 wherein the dripping step is executed to drip the surfactant to central parts of the substrates in a direction perpendicular to an aligning direction of the substrates, and between the substrates.

20 . The substrate treating method according to claim 12 wherein the dripping step is executed to drip the surfactant centrally of an entire surface of the treating solution stored in the treating tank.

21 . The substrate treating method according to claim 12 further comprising a heating step for heating the treating solution;

wherein the surfactant has a boiling point lower than a temperature of the treating solution.

22 . The substrate treating method according to claim 21 wherein the surfactant is a straight chain alcohol.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 19, 2015
From: DAINIPPON SCREEN MFG. CO., LTD.
To: SCREEN HOLDINGS CO., LTD.
Reel/Frame 035049/0171 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2013
From: MIURA, TAKEMITSU
To: DAINIPPON SCREEN MFG. CO., LTD.
Reel/Frame 029877/0479 →