Electronic apparatus and buffer material
View Patent ↗Mounted between bottom and top surfaces of a case are: second buffer materials and first buffer materials brought in surface contact with a bottom surface of a hard disk drive (HDD) via an insulating member, and upper buffer materials brought in surface contact with the opposite side of the HDD via the insulating member. When impact F 2 is applied to the HDD, the second buffer materials contract from a thickness of T 0 to T 2 , and the first buffer materials buckle. Buckling parts of the first buffer materials buckle when the second buffer materials contract to thickness T 2 , and can achieve impact-lessening independently from the second buffer materials. The second buffer materials contract singly from T 0 to equal T 1 to or more than T 2 , whereas the first buffer materials and second buffer materials both act at thickness T 2 or beyond. Therefore, impact-lessening can be achieved in a broad range.
1. An electronic apparatus comprising:
an electronic component;
a case including a lower member supporting the electronic component; and
a buffer part interposed between a bottom surface of the electronic component and the lower member, wherein
the buffer part includes
a first buffer material, and
a second buffer material disposed apart from the first buffer material,
the second buffer material is attached to each of the bottom surface of the electronic component and the lower member, and the second buffer material contracts when a compression load is applied thereto from the bottom surface of the electronic component and the lower member, and is restored when the compression load is removed, and
the first buffer material is attached to the bottom surface of the electronic component or the lower member, and the first buffer material buckles when a compression load is applied thereto from the bottom surface of the electronic component and the lower member during the contraction of the second buffer material, and is restored when the compression load is removed.
2. The electronic apparatus according to claim 1 , wherein
the first buffer material includes:
a support part attached to the bottom surface of the electronic component or the lower member; and
a buckling part protruding from the support part and having a column shaped part that partially buckles when the compression load is applied thereto.
3. The electronic apparatus according to claim 2 , wherein
the buckling part has a circular cross section that is perpendicular to a direction in which the buckling part protrudes from the support part.
4. The electronic apparatus according to claim 2 , wherein
the buckling part is internally hollow at least from a boundary between an inner wall of the buckling part and the support part, to the bottom surface of the electronic component or a surface of the lower member.
5. The electronic apparatus according to claim 1 , wherein
a height of the first buffer material is lower than the height of the second buffer material.
6. The electronic apparatus according to claim 1 , wherein:
the electronic component is an HDD (Hard Disk Drive);
the HDD includes an approximately rectangular-parallelpiped housing, and a disc shaped storage disk held inside the housing and parallel to a bottom surface of the housing; and
the buffer part is disposed in contact with or to oppose a part where the storage disk is not disposed within the housing of the HDD.
7. The electronic apparatus according to claim 6 , wherein:
the case is an HDD case configured to house the HDD;
the lower member has a corner portion defined by first and second sides of the case being adjacent to each other,
the corner portion of the lower member comprises a first slit along the first side and a second slit along the second side,
an angle between the first slit and the second slit is equal to or larger than an angle of a corner portion of a lower surface of the HDD,
the first slit and the second slit connect to each other at the corner portion of the lower member, and form a penetration hole that extends completely through the lower member, and
an inner area of the corner portion of the lower member, that is inward of the penetration hole and bounded by the penetration hole, contacts with and supports the corner portion of the lower surface of the HDD.
8. The electronic apparatus according to claim 1 , wherein
the first buffer material has a column shape, and
the second buffer material has a plate shape.
9. The electronic apparatus according to claim 1 , wherein
the first buffer material has a cylindrical shape that opens at a top end thereof.
10. An electronic apparatus comprising:
a disk drive having a housing;
a case including a lower member supporting the disk drive; and
a buffer part interposed between a bottom surface of the housing and the lower member, wherein
the buffer part includes
a first buffer material, and
a second buffer material disposed apart from the first buffer material,
the second buffer material is attached to each of the bottom surface of the housing and the lower member, and the second buffer material contracts when a compression load is applied thereto from the bottom surface of the housing and the lower member, and is restored to a shape that the second buffer member has before the contraction when the compression load is removed, and
the first buffer material is attached to the bottom surface of the housing or the lower member, and the first buffer material buckles when a compression load is applied thereto from the bottom surface of the housing and the lower member during the contraction of the second buffer material, and is restored to a shape that the first buffer member has before the buckling when the compression load is removed.