IP Library Granted Patent US 8,997,502
Granted Patent B2
US 8,997,502 · App. 13/780,481 · Granted Apr 7, 2015

Thermoelectric assembly for improved airflow

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Quick Facts
Patent No.
US 8,997,502
App. No.
13/780,481
Granted
Apr 7, 2015
Kind
B2
Abstract

In one embodiment, a system includes a first thermoelectric assembly that includes a first set of thermoelectric elements and a first plate and a second plate are coupled to the first set of thermoelectric elements. A second thermoelectric assembly is spaced apart from the first thermoelectric assembly. It includes a second set of thermoelectric elements and a third plate and a fourth plate are coupled to the second set of thermoelectric elements. A first set of fins is coupled to the first plate and a second set of fins is coupled to the third plate. A third set of fins is coupled to the second plate and a fourth set of fins is coupled to the fourth plate. A fan is coupled to the first and second sets of fins and is substantially centered with respect to a gap between the first and second sets of fins.

Claims (52)

1. A system comprising:

a first thermoelectric assembly comprising:

a first set of thermoelectric elements;

a first plate coupled to the first set of thermoelectric elements; and

a second plate coupled to first set of thermoelectric elements;

a second thermoelectric assembly, the second thermoelectric assembly spaced apart from the first thermoelectric assembly, the second thermoelectric assembly comprising:

a second set of thermoelectric elements;

a third plate coupled to the second set of thermoelectric elements; and

a fourth plate coupled to the second set of thermoelectric elements;

a first set of fins coupled to the first plate;

a second set of fins coupled to the third plate, the second set of fins spaced apart from the first set of fins by a first gap;

a third set of fins coupled to the second plate;

a fourth set of fins coupled to the fourth plate, the third set of fins spaced apart from the fourth set of fins by a second gap; and

a first fan coupled to the first set of fins and the second set of fins, the first fan substantially centered with respect to the first gap.

2. The system of claim 1 , further comprising:

a first divider situated in the first gap; and

a second divider situated in the second gap.

3. The system of claim 2 , wherein the first divider and the second divider are angled.

4. The system of claim 2 , wherein the first divider and the second divider are radiused.

5. The system of claim 1 , further comprising a second fan coupled to the third set of fins and the fourth set of fins, the second fan substantially centered with respect to the second gap.

6. The system of claim 1 , wherein the first set of fins and the second set of fins comprise a hydrophobic coating.

7. The system of claim 1 , wherein the first set of fins and the second set of fins comprise skived fins.

8. The system of claim 1 , wherein:

the first set of fins and the second set of fins are integrated into a first structure; and

the third set of fins and the fourth set of fins are integrated into a second structure.

9. The system of claim 1 , further comprising a divider situated in both the first gap and the second gap.

10. The system of claim 1 , further comprising a circuit board, the circuit board coupled to the first set of thermoelectric elements and the second set of thermoelectric elements.

11. A method comprising:

coupling a first set of fins to a first plate of a first thermoelectric assembly, the first thermoelectric assembly comprising:

a first set of thermoelectric elements;

the first plate coupled to the first set of thermoelectric elements; and

a second plate coupled to first set of thermoelectric elements;

coupling a second set of fins to a third plate of a second thermoelectric assembly, the second set of fins spaced apart from the first set of fins by a first gap, the second thermoelectric assembly spaced apart from the first thermoelectric assembly, the second thermoelectric assembly comprising:

a second set of thermoelectric elements;

the third plate coupled to the second set of thermoelectric elements; and

a fourth plate coupled to the second set of thermoelectric elements;

coupling a third set of fins the second plate;

coupling a fourth set of fins to the fourth plate, the third set of fins spaced apart from the fourth set of fins by a second gap; and

coupling a first fan to the first set of fins and the second set of fins, the first fan substantially centered with respect to the first gap.

12. The method of claim 11 , further comprising:

situating a first divider in the first gap; and

situation a second divider in the second gap.

13. The method of claim 12 , wherein the first divider and the second divider are angled.

14. The method of claim 12 , wherein the first divider and the second divider are radiused.

15. The method of claim 11 , further comprising coupling a second fan to the third set of fins and the fourth set of fins, the second fan substantially centered with respect to the second gap.

16. The method of claim 11 , wherein the first set of fins and the second set of fins comprise a hydrophobic coating.

17. The method of claim 11 , wherein the first set of fins and the second set of fins comprise skived fins.

18. The method of claim 11 , wherein:

the first set of fins and the second set of fins are integrated into a first structure; and

the third set of fins and the fourth set of fins are integrated into a second structure.

19. The method of claim 11 , further comprising situating a divider in both the first gap and the second gap.

20. The method of claim 11 , coupling a circuit board to the first set of thermoelectric elements and the second set of thermoelectric elements.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 22, 2019
From: MARLOW INDUSTRIES, INC.
To: II-VI DELAWARE, INC.
Reel/Frame 048669/0830 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 7, 2013
From: AYRES, STEVEN M.; PARISH, OVERTON L., IV
To: MARLOW INDUSTRIES, INC.
Reel/Frame 029938/0015 →