IP Library Granted Patent US 9,337,364
Granted Patent B2
US 9,337,364 · App. 13/781,246 · Granted May 10, 2016

Solid-state imaging element and electronic apparatus

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Quick Facts
Patent No.
US 9,337,364
App. No.
13/781,246
Granted
May 10, 2016
Kind
B2
Abstract

A solid-state imaging element includes a light receiving unit formed on a semiconductor base, and an anti-reflection film formed on the light receiving unit. The anti-reflection film has a plurality of planar layers whose planar layer in an upper layer is narrower than the planar layer in a lower layer.

Claims (17)

1. A solid-state imaging element, comprising:

a light receiving unit formed on a semiconductor base;

an anti-reflection film formed on the light receiving unit, the anti-reflection film having a plurality of planar layers whose planar layer in an upper layer is narrower than the planar layer in a lower layer; and

a waveguide formed above the anti-reflection film, wherein the waveguide comprises a clad layer and a core layer, the clad layer forming a concave portion above the anti-reflection film, and the core layer being formed on the clad layer and filling the concave portion of the clad layer.

2. The solid-state imaging element according to claim 1 , wherein a width and a thickness of each of the plurality of planar layers is selected for each pixel color.

3. The solid-state imaging element according to claim 1 , wherein the core layer having has a refractive index higher than a refractive index of the clad layer.

4. An electronic apparatus, comprising:

an optical system;

a solid-state imaging element including:

a light receiving unit formed on a semiconductor base;

an anti-reflection film formed on the light receiving unit, the anti-reflection film having a plurality of planar layers whose planar layer in an upper layer is narrower than the planar layer in a lower layer; and

a waveguide formed above the anti-reflection film, wherein the waveguide comprises a clad layer and a core layer, the clad layer forming a concave portion above the anti-reflection film, and the core layer being formed on the clad layer and filling the concave portion of the clad layer; and

a signal processing circuit configured to process an output signal of the solid-state imaging element.

5. The electronic apparatus according to claim 4 , wherein a width and a thickness of each of the plurality of the planar layers is selected for each pixel color.

6. The electronic apparatus according to claim 4 , wherein the core layer has a refractive index higher than a refractive index of the clad layer.

7. The solid-state imaging element according to claim 1 , wherein the anti-reflection film includes a material film formed between and a first material film and a second material film, the first material film and the second material film each having a refractive index higher than a refractive index of the material film.

8. The solid-state imaging element according to claim 7 , wherein the first material film and the second material film are formed of different material.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2016
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 040419/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 1, 2013
From: MASUDA, YOSHIAKI; HONDO, KEITA
To: SONY CORPORATION
Reel/Frame 029906/0134 →