Composition for forming aluminum-containing film, and method for forming aluminum-containing film

1. A composition for forming an aluminum-containing film, comprising:

an organic solvent; and

an organic aluminum compound having a structure represented by formula (1):

wherein, in formula (1), each of R 1 to R 6 is independently a hydrogen atom or a hydrocarbon group, each of R 1 s, R 2 s, R 3 s, R 4 s, R 5 s and R 6 s is identical or different, and optionally each of R 1 s, R 2 s, R 3 s, R 4 s, R 5 s or R 6 s is linked to one another.

2. The composition according to claim 1 , wherein the organic aluminum compound is represented by formula (2):

wherein, in formula (2), each R 7 represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 12 carbon atoms.

3. The composition according to claim 2 , wherein, in formula (2), each R 7 represents a monovalent hydrocarbon group having 1 to 4 carbon atoms.

4. The composition according to claim 2 , wherein, in formula (2), each R 7 represents a methyl group, an ethyl group, a propyl group, or an isopropyl group.

5. The composition according to claim 2 , wherein, in formula (2), each R 7 represents a methyl group.

6. The composition according to claim 1 , wherein the organic aluminum compound is represented by formula (3):

wherein, in formula (3), each R 8 represents a bivalent hydrocarbon group having 1 to 12 carbon atoms.

7. The composition according to claim 6 , wherein, in formula (3), each R 8 represents a bivalent hydrocarbon group having 1 to 4 carbon atoms.

8. The composition according to claim 6 , wherein, in formula (3), each R 8 represents an ethylene group or a propylene group.

9. The composition according to claim 6 , wherein, in formula (3), each R 8 represents an ethylene group.

10. The composition according to claim 1 , wherein the organic solvent is a hydrocarbon solvent or a mixed solvent of a hydrocarbon solvent and an ether solvent.

11. A method for forming an aluminum-containing film, comprising:

coating the composition according to claim 1 on a substrate to form a coated layer; and

subjecting the coated layer to heating, electron beam irradiation, ultraviolet irradiation, plasma treatment, or a combination thereof, in an inactive gas or reducing gas atmosphere to cure the coated layer and to form an aluminum nitride film.

12. The method according to claim 11 , wherein the substrate has a substrate body the surface of which has been covered with a film containing aluminum or a transition metal.

13. A method for forming an aluminum-containing film, comprising:

coating the composition according to claim 1 on a substrate to form a coated layer; and

subjecting the coated layer to heating, electron beam irradiation, ultraviolet irradiation, plasma treatment, or a combination thereof, in an oxidizing atmosphere to cure the coated layer and to form an aluminum oxide film.

14. The method according to claim 13 , wherein the substrate has a substrate body the surface of which has been covered with a film containing aluminum or a transition metal.

15. The method according to claim 13 , wherein the oxidizing atmosphere is an oxidizing gas atmosphere.

16. The method according to claim 15 , wherein the substrate has a substrate body the surface of which has been covered with a film containing aluminum or a transition metal.

17. The method according to claim 13 , wherein the oxidizing atmosphere is an air atmosphere.

18. The method for according to claim 17 , wherein the substrate has a substrate body the surface of which has been covered with a film containing aluminum or a transition metal.

19. A method for forming an aluminum-containing film, comprising:

coating the composition according to claim 1 on a substrate to form a coated layer;

subjecting the coated layer to heating, electron beam irradiation, ultraviolet irradiation, plasma treatment, or a combination thereof to form a film containing carbon and aluminum; and

subjecting the film containing carbon and aluminum to hydrothermal treatment to form an aluminum oxide film.

20. The method according to claim 19 , wherein the substrate has a substrate body the surface of which has been covered with a film containing aluminum or a transition metal.