IP Library Granted Patent US 9,376,596
Granted Patent B2
US 9,376,596 · App. 13/782,510 · Granted Jun 28, 2016

Adhesive film and flat cable using the same

Inventors: Daisuke Shanai (Hitachi, JP); Tomiya Abe (Hitachi, JP)
Assignee: HITACHI METALS, LTD.
C09J7/02C09J7/0239H01B7/0823H01B7/295C08K3/0058C08K5/0066C08K5/29C08K2003/2224C09J2201/36C09J2203/326C09J2205/102C09J2467/006C09J2477/00Y10T428/24959Y10T428/264Y10T428/2843
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Quick Facts
Patent No.
US 9,376,596
App. No.
13/782,510
Granted
Jun 28, 2016
Kind
B2
Abstract

There is provided an adhesive film, comprising: an insulator film; an adhesive layer formed on the insulator film; and an intermediate adhesive layer interposed between the insulator film and the adhesive layer, wherein the intermediate adhesive layer is made of a mixed resin composition of a copolyamide being a crystalline resin solvable in a non-halogen based organic solvent and having a melting point of 100° C. or more and 150° C. or less, and a non-crystalline resin, and the intermediate adhesive layer contains a non-halogen flame retardant by 100 pts. wt. or more and 250 pts. wt. or less with respect to 100 pts. wt. of the mixed resin composition.

Claims (36)

1. An adhesive film, consisting of:

an insulator film;

an adhesive layer formed on the insulator film, the adhesive layer made of a material containing any one of resins of polyester, thermoplastic polyurethane, and copolyamide; and

an intermediate adhesive layer interposed between the insulator film and the adhesive layer,

wherein the intermediate adhesive layer is made of a material containing a mixed resin composition, the mixed resin composition consisting of a copolyamide and a non-crystalline resin;

wherein the copolyamide is a crystalline resin solvable in a non-halogen based organic solvent and having a melting point of 100° C. or more and 150° C. or less, and the non-crystalline resin consists of a non-crystalline copolyamide or non-crystalline polyester;

wherein a content of the non-crystalline resin is 10 pts. wt. or more and 80 pts. wt. or less, with respect to 100 pts. wt. of the copolyamide; and

wherein the intermediate adhesive layer contains a non-halogen flame retardant by 100 pts. wt. or more and 250 pts. wt. or less with respect to 100 pts. wt. of the mixed resin composition.

2. The adhesive film according to claim 1 , wherein the copolyamide is solvable in a mixed solvent, the mixed solvent including i) a hydrocarbon solvent having a boiling point of 140° C. or less and ii) alcohols.

3. The adhesive film according to claim 2 , wherein the mixed solvent includes toluene and alcohols, or methylcyclohexane and n-propyl alcohol.

4. The adhesive film according to claim 1 , wherein the non-halogen flame retardant is at least one of a flame retardant selected from the group consisting of a phosphorous compound, a nitrogen compound, and a metal compound.

5. The adhesive film according to claim 1 , wherein the resin of the adhesive layer is solvable in a non-halogen based organic solvent having a boiling point of 120° C. or less.

6. The adhesive film according to claim 1 , wherein thickness Ta of the insulator film, thickness Tb of the adhesive layer, and thickness Tc of the intermediate adhesive layer satisfy a relation of Tc>Ta>Tb.

7. The adhesive film according to claim 1 , wherein the insulator film is a polyethylene terephthalate film having a thickness of 9 μm or more and 35 μm or less.

8. A flat cable comprising:

a pair of the adhesive films according to claim 1 integrally formed by adhesion; and

a plurality of conductors arranged in parallel on planes interposed between adhesive films of the pair.

9. The adhesive film according to claim 1 , wherein the copolyamide of the mixed resin composition is a crystalline copolyamide, the non-crystalline resin of the mixed resin composition is a non-crystalline copolyamide, and the material of the adhesive layer contains polyester.

10. The adhesive film according to claim 1 , wherein the copolyamide of the mixed resin composition is a crystalline copolyamide, the non-crystalline resin of the mixed resin composition is a non-crystalline copolyamide, and the material of the adhesive layer contains polyurethane.

11. The adhesive film according to claim 1 , wherein the copolyamide of the mixed resin composition is a crystalline copolyamide, the non-crystalline resin of the mixed resin composition is a non-crystalline copolyamide, and the material of the adhesive layer contains a copolyamide.

12. The adhesive film according to claim 1 , wherein the copolyamide of the mixed resin composition is a crystalline copolyamide, the non-crystalline resin of the mixed resin composition is a non-crystalline polyester, and the material of the adhesive layer contains polyester.

13. The adhesive film according to claim 1 , wherein the copolyamide of the mixed resin composition is a crystalline copolyamide, the non-crystalline resin of the mixed resin composition is a non-crystalline polyester, and the material of the adhesive layer contains thermoplastic polyester.

14. The adhesive film according to claim 1 , wherein the copolyamide of the mixed resin composition is a crystalline copolyamide, the non-crystalline resin of the mixed resin composition is a non-crystalline polyester, and the material of the adhesive layer contains a copolyamide.

15. An adhesive film, comprising:

an insulator film;

an adhesive layer formed on the insulator film, the adhesive layer made of a material containing any one of resins of polyester, thermoplastic polyurethane, and copolyamide; and

an intermediate adhesive layer interposed between the insulator film and the adhesive layer,

wherein the intermediate adhesive layer is made of a material containing a mixed resin composition, the mixed resin composition consisting of a copolyamide and a non-crystalline resin;

wherein the copolyamide is a crystalline resin solvable in a non-halogen based organic solvent and having a melting point of 100° C. or more and 150° C. or less, and the non-crystalline resin consists of a non-crystalline copolyamide or non-crystalline polyester,

wherein a content of the non-crystalline resin is 10 pts. wt. or more and 80 pts. wt. or less, with respect to 100 pts. wt. of the copolyamide; and

wherein the intermediate adhesive layer contains a non-halogen flame retardant by 100 pts. wt. or more and 250 pts. wt. or less with respect to 100 pts. wt. of the mixed resin composition.

16. The adhesive film according to claim 15 , wherein the intermediate adhesive layer further comprises a carbodiimide compound.

17. The adhesive film according to claim 15 , wherein the adhesive layer further comprises a non-halogen flame retardant.

18. The adhesive film according to claim 17 , wherein the non-halogen flame retardant is 5 pts. wt. or more and 100 pts. wt. or less with respect to 100 pts. wt. of the resin of the adhesive layer.

19. The adhesive film according to claim 15 , wherein the copolyamide of the mixed resin composition is a crystalline copolyamide, the non-crystalline resin of the mixed resin composition is a non-crystalline copolyamide, and the material of the adhesive layer contains polyester, polyurethane, or a copolyamide.

20. The adhesive film according to claim 15 , wherein the copolyamide of the mixed resin composition is a crystalline copolyamide, the non-crystalline resin of the mixed resin composition is a non-crystalline polyester, and the material of the adhesive layer contains polyester, thermoplastic polyester, or a copolyamide.

Assignments (2)
MERGER Recorded Oct 8, 2014
From: HITACHI CABLE, LTD.
To: HITACHI METALS, LTD.
Reel/Frame 033908/0802 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 1, 2013
From: SHANAI, DAISUKE; ABE, TOMIYA
To: HITACHI CABLE, LTD.
Reel/Frame 029907/0579 →
Priority Claims (1)
JP 2012-053861 · Mar 9, 2012 · national
Continuity (1)
Related Publication 20130233590A1 · Sep 12, 2013