Lighting emitting device with aligned-bonding having alignment patterns
View Patent ↗A light-emitting device comprises a semiconductor light-emitting stacked layer having a first connecting surface, wherein the semiconductor light-emitting stacked layer comprises a first alignment pattern on the first connecting surface, and a substrate under the semiconductor light-emitting stacked layer, wherein the substrate has a second connecting surface being operable for connecting with the first connecting surface, wherein the substrate comprises a second alignment pattern on the second connecting surface, and the second alignment pattern is corresponding to the first alignment pattern.
1. A light-emitting device comprising:
a semiconductor light-emitting stacked layer having a first connecting surface, wherein the semiconductor light-emitting stacked layer comprises a first alignment pattern on the first connecting surface; and
a substrate under the semiconductor light-emitting stacked layer, wherein the substrate has a second connecting surface, wherein a first virtual vertical axis passes through a center of the first alignment pattern, a second virtual vertical axis passes through a center of the second alignment pattern, and an offset alignment having a distance between the first virtual vertical axis and the second virtual vertical axis is smaller than 20 μm such that the first alignment pattern and the second alignment pattern are not totally aligned,
wherein the first alignment pattern and the second alignment pattern each comprising a plurality of enclosures.
2. The light-emitting device according to claim 1 , wherein the first alignment pattern and the second alignment pattern are overlapped or are combined to form a third pattern.
3. The light-emitting device according to claim 1 , wherein the difference in the reflectivities between the first alignment pattern and a region of the first connecting surface without the first alignment pattern is larger than 20%, and the difference in the reflectivities between the second alignment pattern and a region of the second connecting surface without the second alignment pattern is larger than 20%.
4. The light-emitting device according to claim 1 , wherein the substrate comprises a second connecting layer connecting with the first connecting surface.
5. The light-emitting device according to claim 1 , wherein the semiconductor light-emitting stacked layer comprises a first connecting layer connecting with the second connecting surface.
6. The light-emitting device according to claim 1 , wherein the first connecting surface comprises a first cavity and/or the second connecting surface comprises a second cavity.
7. The light-emitting device according to claim 6 , wherein the first alignment pattern is in the first cavity and/or the second alignment pattern is in the second cavity.
8. The light-emitting device according to claim 1 , wherein the first alignment pattern and the second alignment pattern avoid contacting to each other.