IP Library Granted Patent US 8,791,749
Granted Patent B2
US 8,791,749 · App. 13/784,675 · Granted Jul 29, 2014

Semicondcutor integrated circuit including power generation block and power supply control block

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,791,749
App. No.
13/784,675
Granted
Jul 29, 2014
Kind
B2
Abstract

A power generation block configured to generate internal power by a charge pump circuit and a power supply control block configured to control the power generation block are provided. First and second power supply interconnects individually separated from an external power supply interconnect are connected to the power generation block and the power supply control block, respectively. At least any one of the power supply interconnects is provided with a filter section configured to remove noise propagating through the power supply interconnect.

Claims (73)

1. A semiconductor integrated circuit provided on a single semiconductor chip, the semiconductor integrated circuit comprising:

an external power supply interconnect through which external power supplied from outside the semiconductor chip is transferred;

a power generation block including a charge pump circuit, and configured to generate internal power by the charge pump circuit based on the external power and output, at an output of the power generation block, the generated internal power, the internal power having a different power supply voltage from the external power;

a power supply control block configured to control the power generation block;

a circuit block configured to operate with the internal power;

a first power supply interconnect branching off from the external power supply interconnect, and connected to an input of the power generation block, the power generation block receiving, at the input of the power generation block, the external power via the first power supply interconnect;

a second power supply interconnect branching off from the external power supply interconnect, and connected to an input of the power supply control block, the power supply control block receiving, at the input of the power supply control block, the external power via the second power supply interconnect; and

a filter section provided on the second power supply interconnect and disposed between the external power supply interconnect and the input of the power supply control block, and configured to remove noise propagating through the second power supply interconnect, wherein:

the filter section includes:

a resistor inserted in the second power supply interconnect; and

a capacitor connected between the second power supply interconnect and ground, and

a first terminal of the capacitor is directly connected to a connection point between the resistor and the power supply control block, and a second terminal of the capacitor is connected to the ground.

2. A semiconductor integrated circuit provided on a single semiconductor chip, the semiconductor integrated circuit comprising:

an external power supply interconnect through which external power supplied from outside the semiconductor chip is transferred;

a power generation block including a charge pump circuit, and configured to generate internal power by the charge pump circuit based on the external power and output, at an output of the power generation block, the generated internal power, the internal power having a different power supply voltage from the external power;

a power supply control block configured to control the power generation block;

a circuit block configured to operate with the internal power;

a first power supply interconnect branching off from the external power supply interconnect, and connected to an input of the power generation block, the power generation block receiving, at the input of the power generation block, the external power via the first power supply interconnect;

a second power supply interconnect branching off from the external power supply interconnect, and connected to an input of the power supply control block, the power supply control block receiving, at the input of the power supply control block, the external power via the second power supply interconnect; and

a filter section provided on the second power supply interconnect and disposed between the external power supply interconnect and the input of the power supply control block, and configured to remove noise propagating through the second power supply interconnect, wherein:

the filter section includes:

a MOS transistor inserted in the second power supply interconnect, and having a gate to which a switch control signal is applied; and

a capacitor connected between the second power supply interconnect and ground, and

a first terminal of the capacitor is directly connected to a connection point between the MOS transistor and the power supply control block, and a second terminal of the capacitor is connected to the ground.

3. The semiconductor integrated circuit of claim 2 , wherein

the switch control signal is applied from outside the semiconductor chip.

4. The semiconductor integrated circuit of claim 2 , wherein:

the switch control signal is also applied to the power generation block, and

the power generation block is configured to stop operating when the switch control signal shows a value to set the MOS transistor to an off state.

5. The semiconductor integrated circuit of claim 1 , further comprising:

a switching element inserted in the external power supply interconnect, wherein:

an on/off operation of the switching element is controlled by a switch control signal, and

a first terminal of the switching element is connected to the external power supply interconnect and a second terminal of the switching element is connected to the first power supply interconnect and the second power supply interconnect.

6. The semiconductor integrated circuit of claim 5 , wherein

the switching element is a MOS transistor having a gate to which the switch control signal is applied.

7. The semiconductor integrated circuit of claim 1 , wherein

the resistor and the capacitor overlap each other when viewed from above.

8. The semiconductor integrated circuit of claim 1 , wherein

at least any one of the resistor and the capacitor overlaps the circuit block or a circuit block other than the circuit block when viewed from above.

9. The semiconductor integrated circuit of claim 1 , wherein

the power generation block is a boosted power supply block configured to generate the internal power having a higher power supply voltage than the external power.

10. The semiconductor integrated circuit of claim 1 , wherein

the circuit block includes a memory core.

11. The semiconductor integrated circuit of claim 1 , wherein

the power supply control block is configured to generate a reference clock signal for controlling a pumping operation of the charge pump circuit, and to supply the generated reference clock signal to the power generation block.

12. The semiconductor integrated circuit of claim 1 , wherein

the power supply control block is configured to generate a reference voltage with which the power supply voltage of the internal power is compared.

13. The semiconductor integrated circuit of claim 2 , further comprising:

a switching element inserted in the external power supply interconnect, wherein:

an on/off operation of the switching element is controlled by a second switch control signal, and

a first terminal of the switching element is connected to the external power supply interconnect and a second terminal of the switching element is connected to the first power supply interconnect and the second power supply interconnect.

14. The semiconductor integrated circuit of claim 13 , wherein

the switching element is a MOS transistor having a gate to which the second switch control signal is applied.

15. The semiconductor integrated circuit of claim 2 , wherein

the power generation block is a boosted power supply block configured to generate the internal power having a higher power supply voltage than the external power.

16. The semiconductor integrated circuit of claim 2 , wherein

the circuit block includes a memory core.

17. The semiconductor integrated circuit of claim 2 , wherein

the power supply control block is configured to generate a reference clock signal for controlling pumping operation of the charge pump circuit, and to supply the generated reference clock signal to the power generation block.

18. The semiconductor integrated circuit of claim 2 , wherein

the power supply control block is configured to generate a reference voltage with which the power supply voltage of the internal power is compared.

19. A semiconductor integrated circuit provided on a single semiconductor chip, the semiconductor integrated circuit comprising:

an external power supply interconnect through which external power supplied from outside the semiconductor chip is transferred;

a power generation block including a charge pump circuit, and configured to generate internal power by the charge pump circuit based on the external power, the internal power having a different power supply voltage from the external power;

a power supply control block configured to control the power generation block;

a circuit block configured to operate with the internal power;

a first power supply interconnect branching off from the external power supply interconnect, and connected to the power generation block;

a second power supply interconnect branching off from the external power supply interconnect, and connected to the power supply control block; and

a filter section provided on the second power supply interconnect, and configured to remove noise propagating through the second power supply interconnect, wherein:

the filter section includes:

a MOS transistor inserted in the second power supply interconnect, and having a gate to which a switch control signal is applied; and

a capacitor connected between the second power supply interconnect and ground, and

the switch control signal is applied from outside the semiconductor chip.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 25, 2015
From: PANASONIC CORPORATION
To: SOCIONEXT INC.
Reel/Frame 035294/0942 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 24, 2014
From: NAKAMURA, TOSHIHIRO; YAMASAKI, YUJI; HIROSE, MASANOBU; IIDA, MASAHISA
To: PANASONIC CORPORATION
Reel/Frame 032033/0934 →