Processes and structures for IC fabrication
The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete components can take advantages of dedicated IC fabrication facilities and achieve more cost effective products. In another embodiment, the present chip assembling provides high density interconnect wires between bond pads, enabling cost-effective assembling of small chip components. In an aspect, the present process provides multiple interconnect wires in the form of a ribbon between the bond pads, and then subsequently separates the ribbon into multiple individual interconnect wires.
1. An integrated component comprising
a plurality of bond pads for connecting functional devices within the integrated component;
a plurality of interconnect wires bonded to the corresponding bond pads, wherein the interconnect wires are bonded to the corresponding bond pads by a conductive adhesive,
wherein the functional devices comprise a beveled slope edge,
wherein the interconnect wires run along a surface of the beveled slope edge.
2. An integrated component as in claim 1 wherein the interconnect wires are bonded to the corresponding bond pads by laser welding, ultrasonic welding, or a conductive adhesive.
3. An integrated component as in claim 1 wherein the ribbon interconnect comprises a sheet of conductive material.
4. An integrated component as in claim 1 wherein the ribbon interconnect comprises a layer of conductive material formed by a printing process.
5. An integrated component as in claim 1 wherein the functional devices are positioned in an at least partially stacked configuration or an at least partially coplanar configuration.
6. An integrated component comprising
a plurality of functional devices, wherein each functional device comprises a plurality of bond pads for connecting between the functional devices;
a plurality of interconnect wires bonded to the corresponding bond pads, wherein the interconnect wires are bonded to the corresponding bond pads by a conductive adhesive,
wherein the plurality of interconnect wires are separated from a ribbon interconnect into individual wires.
7. An integrated component as in claim 6 wherein the functional devices comprise a beveled slope edge, wherein the interconnect wires run along a surface of the beveled slope edge.
8. An integrated component as in claim 6 wherein the interconnect wires are bonded to the corresponding bond pads by laser welding.
9. An integrated component as in claim 6 wherein the interconnect wires are bonded to the corresponding bond pads by ultrasonic welding.
10. An integrated component as in claim 6 wherein the ribbon interconnect is separated by a laser ablating process.
11. An integrated component as in claim 6 wherein the ribbon interconnect comprises a sheet of conductive material.
12. An integrated component as in claim 6 wherein the ribbon interconnect comprises a layer of conductive material formed by a printing process.
13. An integrated component as in claim 6 wherein the functional devices are position in an at least partially stacked configuration.
14. An integrated component as in claim 6 wherein the functional devices are position in an at least partially coplanar configuration.
15. A device comprising
a circuit board;
a plurality of functional devices, wherein each functional device comprises a plurality of bond pads for connecting between the functional devices, wherein a size of the plurality of bond pads is less than 10 microns;
a plurality of interconnect wires bonded to the corresponding bond pads, wherein the plurality of interconnect wires are bonded to the corresponding bond pads by a conductive adhesive, wherein a width of the plurality of interconnect wires is less than 10 microns.
16. A device as in claim 15 wherein the functional devices comprise a beveled slope edge, wherein the interconnect wires run along a surface of the beveled slope edge.
17. A device as in claim 15 wherein the ribbon interconnect comprises a sheet of conductive material or a layer of conductive material formed by a printing process.
18. A device as in claim 15 wherein the functional devices are position in an at least partially stacked configuration or in an at least partially coplanar configuration.
19. An integrated component as in claim 1
wherein a size of the plurality of bond pads is less than 10 microns;
wherein a width of the plurality of interconnect wires is less than 10 microns.
20. An integrated component as in claim 6
wherein a size of the plurality of bond pads is less than 10 microns;
wherein a width of the plurality of interconnect wires is less than 10 microns.